Results 21 to 30 of about 3,856 (291)
ZINC MICRO-ALLOYING ADDITIONS IN Sn-0.7Cu LEAD-FREE SOLDER ALLOYS. SHORT REVIEW [PDF]
European Journal of Materials Science and Engineering, 2017 Sn-Pb solder alloy has been replaced with lead-free solder alloys due to the negative effect for environment and human health. The additions of Zinc (Zn) micro-alloying element in Sn0.7Cu lead-free solder alloy were reported by several researchers in ...
Intan Nashasha Amira IBRAHIM +1 more
doaj
Low Temperature Sealing Process and Properties of Kovar Alloy to DM305 Electronic Glass
Metals, 2020 The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi2O3-ZnO-B2O3 system in atmospheric environment.
Zhenjiang Wang +4 more
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OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS [PDF]
European Journal of Materials Science and Engineering, 2023 Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure
Mohd Izrul Izwan RAMLI +4 more
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Journal of Materials Research and Technology, 2022 The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resistance of 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder alloys in a ...
Balázs Illés +5 more
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Effect of Cr on microstructure and properties of brazed diamond with Ni-based boron free solder
Jin'gangshi yu moliao moju gongcheng, 2022 In view of the problem that B element is easy to cause more hard and brittle phases in brazed diamond joints, a new type of Ni–Cr–Si–Cu–Sn boron free active solder was prepared, and the effects of Cr element on the microstructure of solder and the ...
Pengbo WANG +7 more
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Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]
, 2021 Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
core
Journal of Materials Research and Technology, 2023 In this study, the Sn58Bi-xMg (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were synthesized to explore the impact of Mg particles. The study examined the wettability, thermal properties, mechanical properties, microstructure, and growth of ...
Xi Huang +4 more
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Properties of diffusion-hardening composite solder modified with vanadium powder
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2023 The article considers the effect of vanadium metal powder on the properties of diffusion-hardening solder based on a low-melting gallium-tin alloy and a solid component consisting of a copper-tin alloy powder.
V.М. Skachkov
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MATEC Web of Conferences, 2018 Demand towards smaller electronic devices prompts the electronic interconnection to have less density and minimal weight percentage and such of this concern tips to applications of nanoparticles incorporation to the solder alloy. In this work, the effect
Singh Amares, Durairaj Rajkumar
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Effect of Temperature on the Chip Soldering Process with AuGa0.03 Alloy Solder [PDF]
Crystals, 2020 In this study, soldering is conducted between a chip and a CLCC-3 shell base with a sheet-like AuGa0.03 alloy solder as the encapsulating material. X-ray images of chip soldering samples, XRD diffraction analysis of the joints, SEM images reflecting the microstructures of the joints, and EDS of the cross sections of the chip soldering samples show that
Zhihuan Zhao +6 more
openaire +2 more sources