Results 21 to 30 of about 398,038 (255)
Mechanical Property of Sn-58Bi Solder Paste Strengthened by Resin
Applied Sciences, 2018 Sn-58Bi solder has been widely used for microelectronics packaging due to its low melting point temperature, good wetting performance, good mechanical properties, and low cost.
Lu Liu, Songbai Xue, Siyi Liu
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Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]
, 2004 Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
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ZINC MICRO-ALLOYING ADDITIONS IN Sn-0.7Cu LEAD-FREE SOLDER ALLOYS. SHORT REVIEW [PDF]
European Journal of Materials Science and Engineering, 2017 Sn-Pb solder alloy has been replaced with lead-free solder alloys due to the negative effect for environment and human health. The additions of Zinc (Zn) micro-alloying element in Sn0.7Cu lead-free solder alloy were reported by several researchers in ...
Intan Nashasha Amira IBRAHIM +1 more
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Journal of Materials Research and Technology, 2023 The mechanical mixed Sn58Bi solder reinforced by B4C nanoparticles for the interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear strength of joints with Sn58Bi-xB4C (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) composite solder were
Chen Chen +6 more
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Low Temperature Sealing Process and Properties of Kovar Alloy to DM305 Electronic Glass
Metals, 2020 The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi2O3-ZnO-B2O3 system in atmospheric environment.
Zhenjiang Wang +4 more
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Journal of Materials Research and Technology, 2022 The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resistance of 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder alloys in a ...
Balázs Illés +5 more
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OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS [PDF]
European Journal of Materials Science and Engineering, 2023 Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure
Mohd Izrul Izwan RAMLI +4 more
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, 2020 International audienceLow-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different ...
Van Nhat Le +9 more
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MATEC Web of Conferences, 2018 Demand towards smaller electronic devices prompts the electronic interconnection to have less density and minimal weight percentage and such of this concern tips to applications of nanoparticles incorporation to the solder alloy. In this work, the effect
Singh Amares, Durairaj Rajkumar
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Journal of Materials Research and Technology, 2023 In this study, the Sn58Bi-xMg (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were synthesized to explore the impact of Mg particles. The study examined the wettability, thermal properties, mechanical properties, microstructure, and growth of ...
Xi Huang +4 more
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