Results 81 to 90 of about 3,856 (291)
Advances in Materials Science and Engineering, 2017 The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min.
Janusz Pstruś +2 more
doaj +1 more source
Advanced Science, EarlyView.Current technologies for spinal cord optogenetic stimulation rely on external power sources and face reliability constraints in freely behaving animals. Here, a fully implantable, battery‐powered optoelectronic device is introduced, enabling operation in any selected environment with wireless recharging for months‐long stimulation.
Shahriar Shalileh +8 more
wiley +1 more source
Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy [PDF]
, 2016 This research was carried out to investigate the effects of sintering temperature on the properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy by varying the temperatures.
M., Ishak +2 more
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Materials & DesignAluminum alloy liquid-cooled plates are the most widely used heat management technology in high-end servers and aerospace thermal control systems. Due to the natural oxidation layer, welding and effective connection of aluminum alloys are still difficult,
Ruofan Wang +4 more
doaj +1 more source
Electric‐Current‐Induced Phase Transformation in Cu6Sn5 Below Its Equilibrium Transition Temperature
Advanced Science, EarlyView.Electric current induces a monoclinic‐to‐hexagonal phase transformation in Cu6Sn5 at a measured bulk temperature of ∼120°C, below the equilibrium transition temperature. Ex situ synchrotron x‐ray diffraction, TEM, and matched thermal controls show that current stressing promotes the formation of a retained hexagonal η‐phase post‐stress state not ...
Shih‐kang Lin +3 more
wiley +1 more source
Investigation of a New Sn–Cu–Ga Alloy Solder
, 2011 Soldering processes involving the use of Pb have been known and practiced for more than 5000 years. In 2000, the European Union imposed a ban on the use of Pb because of the fact that Pb is poisonous to humans.
Y. Sasaki, Y. Ikuta, M. Matsushita
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Journal of Materials Research and TechnologyThis essay aims to comparatively study the microscopic morphology and grinding properties of brazed diamonds with amorphous and crystalline filler alloy in the case of rare-earth Nd-doped modified Ni-based filler alloy.
Tian Jin +6 more
doaj +1 more source
Advanced Science, EarlyView.Designed and demonstrated a flexible metamaterial absorber via loss engineering for large‐area ultra‐broadband infrared extinction, providing a new method for miniaturization of absorbers and flexible optical devices. ABSTRACT The advancement of compact and wearable optical systems is critically limited by the lack of high‐performance, integrable ...
Zhe Wu +11 more
wiley +1 more source
Effect of nickel doping into solder alloy and its strength between SnCu-Ni/immersion gold joint [PDF]
, 2017 Flip chip assembly, which is well known as controlled collapse chip connection (C4) has been widely used in semiconductor industry. Solder acts as a joining material in flip chip to interconnect chip with substrate, in order to provide electrical and ...
Zetty Akhtar, Abd Malek
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Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloy
, 2023 Nanocomposite solders were prepared by adding graphene nanoplatelets (GNPs) and carbon nanotubes (CNTs) into the eutectic Sn-Ag-Cu solder alloy according to the mechanical alloying and compaction consolidation of the mixed materials. Then, the effects of
Khatibi Damavandi, Golta +1 more
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