Results 101 to 110 of about 398,038 (255)
This work reports a laser diode‐based self‐mixing interferometry imager featuring illumination‐invariance imaging, a 500 kHz pixel rate, and an 8.77 µm lateral resolution. It also features a programmable field‐of‐view and leading space‐bandwidth product that surpasses existing technologies by an order of magnitude, enabling cross‐scale workflow ...
Zhou Su +5 more
wiley +1 more source
The Joule heat generated during the opreation of microelectronic devices can subject the Sn-Bi solder alloy to isothermal aging, which affects the reliability of solder joint interconnections. In this study, the effect of nickel-modified reduced graphene
Wenchao Yang +7 more
doaj +1 more source
Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations [PDF]
In this paper, viscoplastic deformations of Sn-3.5Ag-0.75Cu solder alloy are discussed. First, the following experiments are conducted: (1) Pure tension at several strain rates.
Sasaki, Katsuhiko +2 more
core
Multi‐element electrical resistance probes fabricated from industrial carbon steels enable real‐time corrosion monitoring in natural seawater and soil. A micro‐alloyed grade (AMLoCor) demonstrates up to 2.4 times improved uniform corrosion resistance over conventional S355 GP steel.
Erwan Diler, Johan Becker, Thomas Urios
wiley +1 more source
Wettability of low silver content lead-free solder alloy
Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1,0.3,0.5) on copper substrate was investigated. Wetting balance test results indicated that varying small Ag content in the alloy affects the wettability of solders with ...
Dharma, I. +3 more
core +1 more source
This work deals with the degradation of solar modules with varying material combinations under accelerated aging conditions. By in situ moisture measurements and simulations of oxygen ingress, the consumption of stabilizing additives and polymer degradation can be correlated spatially resolved with the penetrating stressors.
Robert Heidrich +11 more
wiley +1 more source
The miniaturization, high-density integration, and multifunctionalization of electronic devices impose increasingly stringent performance requirements on solder alloys employed in microelectronic packaging.
Jianchao Liang +9 more
doaj +1 more source
Effect of the LaNd Addition on Melting Point and Spreading Properties of Bi5Sb8Sn Solder Alloy
Bi5Sb8Sn solder alloy is the most promising alternative to existing high-Pb solder as high-temperature lead-free soft solder alloy series whose melting point is about 264°C and have better conductivity and mechanical properties, but its wettability need ...
Zhi Wei Xu +5 more
core +1 more source
A bias‐free photovoltaic‐photoelectrochemical tandem system enables simultaneous methane and glycerol upgrading to formic acid under ambient conditions. The cathode generates hydrogen peroxide for methane oxidation, while the photoanode efficiently oxidizes glycerol.
Ho Kun Woo +5 more
wiley +1 more source
The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus
Roman Kolenak +5 more
doaj +1 more source

