Results 101 to 110 of about 3,856 (291)

3D‐Printed Magnetoelectronics for Interactive Appliances and Self‐Aware 4D‐Printed Mechatronics

Advanced Science, EarlyView.
3D‐printed magnetoelectronics integrate high‐performance magnetic field sensing directly into complex structural components. Flexible spring and cross‐shaped sensors exhibit giant magnetoimpedance and 3D Hall sensing for vector field reconstruction. Applications include smart‐home switches, robotic joysticks, volumetric magnetometers, and self‐aware 4D‐
Eduardo Sergio Oliveros‐Mata, Anna Martin Vilardell, Fabian Ganss, Christoph Leyens, Lukas Stepien, Denys Makarov   +5 more
wiley   +1 more source

Characterization and Failure Analysis of Solder Joints in Ball Grid Array (BGA) Components Using Cross-Section, Dye and Pry, and Microstructural Etching Techniques [PDF]

Materials Research
This study investigates failures in solder joints of Ball Grid Array (BGA) components using destructive techniques such as cross-section, dye and pry, and chemical etching with metallographic reagents.
G.F.R.C. Pádua, L.F.S. Figueiredo, G.S. Rocha, J.S.M. Junior, J.S. de Oliveira, R.S. Barboza, A.C. Kieling, J.C. Macêdo Neto   +7 more
doaj   +1 more source

A General and Efficient Framework for the Rapid Design of Miniaturized, Wideband, and High‐Bit RIS

Advanced Electronic Materials, EarlyView.
A general and efficient framework is proposed for the rapid design of high‐performance reconfigurable intelligent surfaces (RISs). This framework integrates advanced antenna design techniques and incorporates various load types, quantities, and values to achieve the design of high‐performance RISs.
Jun Wei Zhang, Zheng Xing Wang, Wanwan Cao, Zhen Jie Qi, Li Jie Wu, Han Qing Yang, Qun Yan Zhou, Si Ran Wang, Hui Dong Li, Jun Yan Dai, Jiang Luo, Jun Wei Wu, Jia Nan Zhang, Zhen Zhang, Qiang Cheng   +14 more
wiley   +1 more source

Microstructure and mechanical properties of Sn-Bi, Sn-Ag and Sn-Zn lead-free solder alloys

, 2015
Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)The aim of this paper is to develop a comparative evaluation of mechanical properties of as-cast Sn-Bi, Sn-Ag and Sn-Zn ...
Osorio, WR, Mangelinck-Noel, N, Peixoto, LC, Garcia, A, Garcia, LR   +4 more
core   +1 more source

Enhanced Hydrogen Generation from Magnesium-Aluminum Scrap Ball Milled with Low Melting Point Solder Alloy. [PDF]

Materials (Basel), 2023
Buryakovskaya OA, Ambaryan GN, Suleimanov MZ, Tarasenko AB, Vlaskin MS.   +4 more
europepmc   +1 more source

An Electrically Conducting Water‐based Reversible Adhesive

Advanced Electronic Materials, EarlyView.
A water‐based reversible glue is demonstrated. The glue has electrical properties similar to other conducting adhesives but can detach after an alkaline wash. Metal fillers are added to an aqueous mixture of polymer nanoparticles synthesized by emulsion polymerization. The nanoparticles are stabilized by poly(acrylic acid) chains bonded to them. The pH‐
Bassam A. Aljohani, Ama B. Asiedu‐Asante, Adriana Sierra‐Romero, Katarina Novakovic, Volker Pickert, Mark Geoghegan   +5 more
wiley   +1 more source

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy. [PDF]

Materials (Basel), 2022
Roduan SF, Wahab JA, Salleh MAAM, Mahayuddin NAHM, Abdullah MMAB, Halil ABM, Zaifuddin AQS, Muhammad MI, Sandu AV, Baltatu MS, Vizureanu P.   +10 more
europepmc   +1 more source

Self‐Adhesive Conductive Elastomers for Gel‐Free Biopotential Recording

Advanced Electronic Materials, EarlyView.
σPOMaC, a self‐adhesive conductive citrate elastomer incorporating PEDOT:PSS and DBSA, enables gel‐free biopotential electrodes with stable conductivity and intrinsic skin adhesion. The composite exhibits low resistivity (∼ 0.02 Ω·cm), robust electrical performance during repeated use, and reliable on‐body ECG acquisition comparable to Ag/AgCl ...
Kirstie M. K. Queener, Alec Brewer, He Sun, Jack Twiddy, Vladimir A. Pozdin, Koji Sode, Alper Bozkurt, Michael Daniele   +7 more
wiley   +1 more source

Effect of the Content of Sn on Microstructure and Mechanical Properties of Bi5Sb Solder Alloy

, 2010
By alloying principle, a novel quaternary high-temperature lead-free solder was formed by adding trace Sn into Bi5Sb2Cu. The influences of trace Sn on the microstructure and mechanical properties of the novel solder alloy were systematically investigated.
Kun Tang, Li Fang Feng, Kuai Le Zhao, Yang Yang Sheng, Yan Fu Yan   +4 more
core   +1 more source

Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite. [PDF]

Materials (Basel), 2021
Kolenak R, Kostolny I, Drapala J, Babincova P, Pasak M.   +4 more
europepmc   +1 more source