Results 111 to 120 of about 398,038 (255)
Whisker Development from SAC0307-Mn07 Solder Alloy [PDF]
In this study, the whisker growth from SAC0307-Mn07 solder alloy was investigated. To get fast information, an ultra-thin film was vacuum evaporated from the examined solder alloy onto Cu substrates.
Illés, Balázs +4 more
core
This work uses high‐temperature dilatometry to examine how the tramp elements Cu, Ni, and Sn affect the deformability of non‐metallic inclusions and matrix in quench‐and‐temper steel. Mg‐bearing inclusions deform less than Mg‐free ones. Copper lowers formability. Nickel increases deformability.
Julian Cejka +3 more
wiley +1 more source
Future of edge AI in biodiversity monitoring
Abstract Many ecological decisions are slowed by the gap between collecting and analysing biodiversity information. Edge computing moves data processing closer to the sensor, with edge artificial intelligence (AI) using AI models for data processing and selective data transfer.
Aude Vuilliomenet +2 more
wiley +1 more source
Accelerated testing methodology for lead-free solder interconnects
The purpose of accelerated testing is to provoke the same failure in a product during the test as it occurs in the real world but in shorter time than in the application.
Grossmann, G. (author)
core +1 more source
The copper crystal cone-shaped micro-nanostructure is used as the substrate, and the Ni–W alloy layer and Au nanolayer are plated sequentially. Instantaneous soldering with lead-free solder is realized under ultrasonic assistance at room temperature ...
Jin Xiao, Qian Zhai, Jia Luo
doaj +1 more source
We used a comparative study design to quantify population densities, structure, survival, cause‐specific mortality and female productivity in four West‐European hedgehog (Erinaceus europaeus) populations, and to forecast the impact of road mortality on population viability.
Lauren J. Moore +7 more
wiley +1 more source
This research work investigates the effect of nickel addition (Ni) on electromigration failure resistance of lead-free solder alloy Sn–30Bi as a thermal interface material.
Munim Shahriar Jawad +3 more
doaj +1 more source
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb. [PDF]
Skwarek A +4 more
europepmc +1 more source
In retrospective studies the prevalence of tin sensitization and its clinical relevance was evaluated in two groups: consecutive patients and patients suspected of metal allergies. The prevalence was higher than previously reported and relevance could be established for ~30%.
Sylvie M. Franken +5 more
wiley +1 more source
Even expensive 10K and 14K gold earrings released measurable gold in cysteine‐modified artificial sweat, despite no detectable nickel. Surface gold content did not predict release, challenging assumptions that higher gold content means lower exposure. ABSTRACT Background Gold contact allergy is common, but its clinical relevance is often uncertain.
Mikkel Bak Jensen +5 more
wiley +1 more source

