Results 111 to 120 of about 3,856 (291)
Advanced Electronic Materials, EarlyView.Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley +1 more source
Advanced Energy Materials, EarlyView.Organic photoelectrochemical cells based on π‐conjugated semiconductors offer a versatile platform for solar fuel generation. This review outlines operating principles, device architectures, and key metrics, and highlights advances in p‐ and n‐type photoelectrodes, interfacial engineering, and catalyst integration.
Jaehyeong Kim +8 more
wiley +1 more source
ELECTROCHEMICAL MIGRATION BEHAVIOR OF Sn-3.0Ag-0.5Cu SOLDER ALLOY UNDER THIN ELECTROLYTE LAYERS
, 2019 The electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder alloy under thin electrolyte layers was investigated using a technique based on the coupling of in situ electrochemical measurements and optical observation.
BOKAI LIAO +4 more
core +1 more source
Modular Electronic Microrobots With Onboard Sensor‐Program‐Steered Locomotion
Advanced Intelligent Systems, EarlyView.Modular electronic smartlet microrobots integrate ambient‐light energy harvesting, photodetection, programmable CMOS control, and bubble‐based actuation within a sub‐millimeter fold‐up architecture. A 58‐bit on‐board CMOS chiplet enables sensor–program steered switching between independently addressable actuators, achieving closed‐loop 2D navigation in
Vineeth K. Bandari +6 more
wiley +1 more source
Influence of low temperature lead free solder alloy amount on shear strength of solder joints
, 2017 Předkládaná bakalářská práce je zaměřena na vliv množství nízkoteplotní pájecí slitiny na mechanickou pevnost pájených spojů. Dále jsou zde popsány nejčastěji používané testy pro zjišťování mechanické pevnosti pájených spojů.
Dammerová, Lucie
core
Al-Khawarizmi Engineering Journal, 2017 This study investigates the mechanical compression properties of tin-lead and lead-free alloy spherical balls, using more than 500 samples to identify statistical variability in the properties in each alloy. Isothermal aging was done to study and compare
Alaa Hasan Ali
doaj
Soft Active Electromyography Interface for Machine Learning‐Enabled Silent Speech Recognition
Advanced Intelligent Systems, EarlyView.A soft, hand‐worn electromyography interface enables intent‐driven silent speech recognition without continuous facial attachment. The device integrates liquid‐metal interconnects, a transparent flexible circuit, and elastomer encapsulation with a fingertip electrode that contacts perioral muscles only on demand.
Yuta Kurotaki +8 more
wiley +1 more source
Simulation of Grain Growth in a Near-Eutectic Solder Alloy [PDF]
, 1999 Microstructural evolution due to aging of solder alloys determines their long-term reliability as electrical, mechanical and thermal interconnects in electronics packages.
Vianco, Paul T., Tikare, Veena
core
STRUCTURE AND ELECTRICAL PROPERTIES OF Sn8Zn SOLDER ALLOY WITH Ag AND Ga ADDITIONS
, 2013 Solder joints based on eutectic SnZn alloy were studied. The influence of Ga and Ag was analysed and compared to the basic Sn8Zn alloy as well as to the reference solder alloys Sn60Pb40 and Sn3Cu.
Perek-Nowak, Małgorzata +1 more
core +1 more source
Materials & DesignThe Joule heat generated during the opreation of microelectronic devices can subject the Sn-Bi solder alloy to isothermal aging, which affects the reliability of solder joint interconnections. In this study, the effect of nickel-modified reduced graphene
Wenchao Yang +7 more
doaj +1 more source