Results 131 to 140 of about 3,856 (291)

Anode‐Free All‐Solid‐State Batteries: Understanding Limitations and Charting a Path to Enhanced Performance

Small, EarlyView.
This review examines four factors that drive interfacial instability in sulfide‐based anode‐free all‐solid‐state batteries and thoroughly reviews corresponding performance‐enhancing strategies. The strategies are organized as follows: (1) interlayer engineering, (2) pressure‐regulating buffer layers, (3) other methods, including sacrificial cathodes ...
Sion Kim, Jaechan Lee, Jihyun Jang
wiley   +1 more source

Recycling End‐of‐Life Solid Oxide Cell Interconnect Assemblies into Commercial‐Grade AISI 304 Stainless Steels

steel research international, EarlyView.
This study validates a recycling pathway for converting interconnect assemblies from end‐of‐life SOC stacks into commercial‐grade AISI 304 steels. Using scrap‐based steelmaking operations, austenitic cast steels with <4.0% δ‐ferrite are successfully produced.
Jeraldine Lastam, Shine‐Od Mongoljiibuu, Alexander Specht, Daniel Grüner, Dmitry Sergeev, Urs A. Peuker, Michael Müller, Ruth Schwaiger   +7 more
wiley   +1 more source

Low temperature In–Bi–Zn solder alloy on copper substrate

, 2016
In this paper, characteristic of In–32.7Bi–0.5Zn lead-free solder system have been studied. DSC shows that, In–32.7Bi–0.5Zn system alloy give low melting temperature at 72.30 °C.
Mhd Noor, Ervina Efzan, Zuhailawati, H., Radzali, Othman   +2 more
core   +1 more source

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSb. [PDF]

Materials (Basel), 2020
Skwarek A, Illés B, Hurtony T, Bušek D, Dušek K.   +4 more
europepmc   +1 more source

Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy

Journal of Materials Research and Technology
This study mainly focuses on the effects of different Ni content in Sn–Ag–Cu–Ni solder alloys on their electrochemical corrosion behavior and solderability. The results demonstrate that the addition of nickel significantly refines β-Sn grains, promotes the formation of the intermetallic compound (Cu,Ni)6Sn5 by partially substituting the Cu6Sn5 phase ...
Ziheng Zhao, Xuan Liu, Luntao Wang, Jialiang Song, Xianqin Zhuo, Yao Tan, Hao Zhang, Heqian Wang, Junsheng Wu, Kui Xiao   +9 more
openaire   +2 more sources

Analyses of the Deformability and Chemistry of Non‐Metallic Inclusions in QT Steels With Increased Recycling‐Induced Tramp Element Content

steel research international, EarlyView.
This work uses high‐temperature dilatometry to examine how the tramp elements Cu, Ni, and Sn affect the deformability of non‐metallic inclusions and matrix in quench‐and‐temper steel. Mg‐bearing inclusions deform less than Mg‐free ones. Copper lowers formability. Nickel increases deformability.
Julian Cejka, Isabell Gruber, Gerald Klösch, Susanne Katharina Michelic   +3 more
wiley   +1 more source

Solder paste mixture [PDF]

, 1994
A solder paste is composed of a vehicle (or flux) system and a mixture of at least two solder powders. One component of this mixture is a eutectic or near-eutectic Sn/Pb alloy powder, while the other component comprises powders selected from at least one
Degani, Yinon, Dudderar, Thomas D, Blonder, Greg   +2 more
core  

Criteria for Solder Alloy Adoption

Journal of Surface Mount Technology
ABSTRACT Solder is a critical component in modern electronic systems – past, present, and future. While solder is used within packaged electrical devices, the highest volume of solder is used for fabrication of printed circuit board assemblies.
Deng Yun Chen, Michael Osterman, Carol Handwerker, Sa'd Hamasha   +3 more
openaire   +1 more source

A comprehensive review of radiation effects on solder alloys and solder joints

Defence Technology
In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties.
Norliza Ismail, Wan Yusmawati Wan Yusoff, Nor Azlian Abdul Manaf, Azuraida Amat, Nurazlin Ahmad, Emee Marina Salleh   +5 more
openaire   +2 more sources

Organisational dehumanisation: Authority as remedy

European Management Review, EarlyView.
Abstract According to orthodoxy, the human relations movement was a watershed in rehumanising scientifically managed workplaces. In the wake of such purported reform, pundits (theorists and practitioners alike) have typically taken for granted that 21st century approaches to workplace superintendence, birthed in the wake of the Hawthorne Studies and ...
Jean‐Etienne Joullié, Anthony M. Gould, Jeffrey Muldoon   +2 more
wiley   +1 more source