Results 131 to 140 of about 398,038 (255)
Advanced Healthcare Materials, Volume 15, Issue 37, 9 October 2026.Application of a zwitterionic poly(sulfobetaine methacrylate) (PSB) coating to microelectrode arrays and Ag/AgCl reference electrodes effectively inhibits biofouling and structural degradation. This strategy successfully enables simultaneous, long‐term electrophysiological recording and dopamine sensing in freely behaving mice, facilitating ...
Bingchen Wu +5 more
wiley +1 more source
The Effect of Rare Earths Additions on the Microstructure and the Corrosion Behavior of Sn-0.7Cu-0.075Al Solder Alloy. [PDF]
Materials (Basel), 2019 Yang W +7 more
europepmc +1 more source
A Geometrically Transient Platform for Bioelectronic Implants
Advanced Materials, Volume 38, Issue 55, 1 October 2026.Minimally invasive bioelectronic implants often compromise performance for smaller sizes. To resolve this optimization dilemma, a wireless bioelectronic implant with a transient geometry is introduced (MiFi). The origami‐inspired device miniaturizes up to sixfold for syringe insertion and autonomously unfolds post‐implantation.
Selin Olenik +13 more
wiley +1 more source
Computational and Experimental Thermoelectric Properties of YCuSb2
Advanced Sustainable Systems, Volume 10, Issue 10, October 2026.The thermoelectric properties of the topological material YCuSb2 and its Te‐doped derivatives are investigated through a combination of experimental and computational methods. The materials exhibit low lattice thermal conductivity and electrical resistivity due to high carrier concentrations.
Noah Losier +5 more
wiley +1 more source
Influence of low temperature lead free solder alloy amount on shear strength of solder joints
, 2017 Předkládaná bakalářská práce je zaměřena na vliv množství nízkoteplotní pájecí slitiny na mechanickou pevnost pájených spojů. Dále jsou zde popsány nejčastěji používané testy pro zjišťování mechanické pevnosti pájených spojů.
Dammerová, Lucie
core
Applied Research, Volume 5, Issue 5, October 2026.Damp heat aging degraded both solder interconnections and silicon solar cells, leading to increased electrical resistance and reduced photoluminescence intensity. Among the solder alloys evaluated, SnAgCu exhibited the most stable electrical performance, making it a promising candidate for improving the long‐term reliability of solar‐powered UAVs ...
Norliza Ismail +6 more
wiley +1 more source
Cerium as corrosion inhibitor for Sn-3Ag-0.5Cu solder alloy in 3.5% NaCl solution. [PDF]
Sci RepVani R, Kumar G, Sharma S, Hegde A.
europepmc +1 more source
Fast Process Development Made Possible Using an Easy to Duplicate Integrated Microfluidic Platform
Chemistry–Methods, Volume 6, Issue 10, October 2026.We present a next‐generation microfluidic platform that accelerates membrane process development through integrated flow control, inline XRF monitoring, and machine‐learning‐assisted optimization. Demonstrated with a charged nanosheet membrane selectively recovering silver from real e‐waste leachates, the system enables rapid, Iow‐consumption, real ...
Iyo Baudouy +7 more
wiley +1 more source
Effects of Al Element on the Microstructure and Properties of Sn-9Zn Solder Alloy. [PDF]
Materials (Basel)Yang J, You Y, Jiang G, Li C.
europepmc +1 more source
Development of Lead Free sn-bi-cu Solder Alloy
, 2018 Until recently, lead-containing alloys were considered to be the most suitable soldering materials widely applied in the automotive industry and in several other sectors.However,with the implementation of EU(European union) environmental ...
Jindal, Nikhil
core