The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy. [PDF]
Materials (Basel)State Rosoiu SP +4 more
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Ultrasonic Soldering of AlN/Cu Using SiC-Modified Zn5Al3Ti Active Solder. [PDF]
Materials (Basel)Melus T +4 more
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Review of Welding Technologies for Electronic Precision Equipment: Status, Limitations, and Prospects. [PDF]
Materials (Basel)Cai H +6 more
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Application of Porous Copper-Based Interconnect Materials in Electronic Packaging: A Brief Review. [PDF]
Materials (Basel)Liu J +7 more
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Microstructural Change Due to Aging and Its Effect on Fatigue Properties in Sn-Sb-Ag-Ni-Ge Alloy. [PDF]
Materials (Basel)Mitsui K +3 more
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Undercooled liquid metal particles as gateway to low-temperature processing and non-equilibrium dynamics. [PDF]
iScienceMartin A, Peralta J, Thuo M.
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Loose Particle Material Identification for Sealed Electronic Devices Using Pulse Endpoint Detection and CEEMDAN Feature Optimization. [PDF]
Sensors (Basel)Ren Z, Wang K, Lu Y, Song S, Zou X.
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Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging. [PDF]
Materials (Basel)Park JY, Yoo S.
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Low thermal stress and high-strength interface in brazing welding Nd:YAG-based advanced laser components. [PDF]
RSC AdvZhang B +9 more
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Progress and Challenges in Joining for Precision Endoscope Fabrication. [PDF]
Sensors (Basel)Xu P, Zheng X, Li L, Wang Z.
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