Design of an 8‐Channel Transmit 32‐Channel Receive 11.7T Head Coil and Evaluation of SNR Gains
ABSTRACT Purpose To design and develop an 8‐channel transmit 32‐channel receive 11.7T head coil for the strongest human MRI scanner to date, demonstrate safety, and evaluate signal‐to‐noise ratio (SNR) gains compared to 7T, the most used ultra‐high‐field (UHF) platform.
Son Chu +8 more
wiley +1 more source
Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment. [PDF]
Wang L +10 more
europepmc +1 more source
Production and computational investigation of high entropy solder alloy
In the present study, lead-free high entropy Sn25Cu15Al20Mg20Zn20 solder alloy was produced. High entropy solder alloys were prepared by pressing-sintering (powder metallurgy).
MUTLU, İLVEN +3 more
core +1 more source
A low‐cost, portable, medium‐resolution polarizing digital light microscope device for monitoring crystal growth and for crystal harvesting is described. The device can be used with a cell phone or a personal computer for real‐time imaging by professional and amateur scientists alike.Motivated by the need for a convenient way to demonstrate the growth ...
Sarah Kennedy +7 more
wiley +1 more source
Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]
Jeyeselan L, Mhd Noor EE.
europepmc +1 more source
Distinct EEG Features and Sleep/Wake Behaviour Predict Anxiety Phenotypes in Mice
ABSTRACT Preoperative anxiety is a prevalent clinical problem linked to adverse surgical outcomes, including elevated pain, prolonged hospital stays and increased risk of postoperative delirium. Current assessments rely heavily on subjective measures, necessitating objective biomarkers.
A. Altunkaya +7 more
wiley +1 more source
Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. [PDF]
Sloboda M +6 more
europepmc +1 more source
Commercially available electrically conductive tapes are evaluated as low‐temperature interconnection materials for next‐generation photovoltaic devices. The tapes provide stable electrical contacts, strong adhesion, and module reliability comparable to advanced solder‐free technologies while eliminating thermal curing.
Yanxin Liu +11 more
wiley +1 more source
Research Overview on the Electromigration Reliability of SnBi Solder Alloy. [PDF]
Li W, Guo L, Li D, Liu ZQ.
europepmc +1 more source
Electrochemical Migration Study on Sn-58Bi Lead-Free Solder Alloy Under Dust Contamination. [PDF]
Lu F +7 more
europepmc +1 more source

