3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity. [PDF]
Kim Y, Kim J.
europepmc +1 more source
ABSTRACT “I felt as if my body was being occupied by the factory.” The words of one woman working in Turkey's heavy industry were repeated in many accounts, capturing how industrial infrastructures calibrated to male norms press directly into women's bodies.
Esra Kasap +2 more
wiley +1 more source
Effects of Sb on the properties and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints
This study investigated the influence of Sb addition on the microstructure, thermal behavior, mechanical properties, and interfacial evolution of SAC305-2Bi-xSb/Cu solder joints. Compared with the SAC305-2Bi alloy, the melting temperature and pasty range
Yingde Miao +8 more
doaj +1 more source
Peri‐implantitis—Is it mainly a clinician‐initiated complication of implant therapy?
Abstract Aim The high prevalence of peri‐implantitis is concerning, with a growing consensus that the majority of cases are complications initiated by clinician‐related errors rather than classic pathology. A primary predisposing factor for peri‐implantitis is exposure of the micro‐rough implant surfaces to the peri‐implant sulcus after treatment ...
Stephen T. Chen +9 more
wiley +1 more source
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. [PDF]
Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga ...
Mayappan, Ramani
core
Undercooling of Sn-Ag-Cu alloys: solder balls and solder joints solidification
International audienceThe degree of undercooling of three Pb-free solders Sn-4.5 %Ag-0.5 %Cu, Sn-4.0 %Ag-0.5 %Cu and Sn-2.5 %Ag-0.5 %Cu (wt.%) are determined using differential scanning calorimetry in two configurations (i) solder balls and (ii) solder ...
Petit, L. +4 more
core +1 more source
To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO2 nanoparticles were incorporated into Sn58Bi solder by a melt-casting method, and their effects on the microstructure ...
Weiming Chen +4 more
doaj +1 more source
Abstract figure legend Integrated multimodal platform for panoramic cardiac mapping in isolated heart experiments. On the left, an image of the experimental setup during data acquisition showing a Langendorff‐perfused rabbit heart surrounded by three optical cameras (CAM A, B and C) positioned 120° apart, each coupled with high‐power LEDs for panoramic
Jimena Siles +8 more
wiley +1 more source
Characterization of a two‐phase hybrid flotation column
Abstract This study explored the performance of a novel hybrid flotation column, which combines the advantages of a mechanically agitated cell with a flotation column and compared the results with a conventional flotation column setup. The experiments were performed in an air/water two‐phase system under varying airflow rates, frother concentrations ...
Pedro Silva Aires +3 more
wiley +1 more source
Characterization Of Indium Based Low Temperature Solder Alloy And The Effect On Surface Finish [PDF]
The increased use of electronic devices has increased the usage of solder connections. Lead, the prime solder hitherto used, is hazardous to human health and the environment.
Mhd Noor, Ervina Efzan
core

