Results 161 to 170 of about 398,038 (255)

Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints. [PDF]

Micromachines (Basel)
Xiao Y, Bai Y, He X, Cui Q, Cheng L, Yang R, Zhang Q, Wang Y.   +7 more
europepmc   +1 more source

Research on the Composition and Manufacturing Technology of the Single-Eared Octagonal Gold Cup Unearthed from the Turki Mountain Tomb in Inner Mongolia. [PDF]

Materials (Basel)
Zhang Y, Dong L, Hu W, Yang L, Li L.
europepmc   +1 more source

Study on warpage stress in SiP packages during reflow soldering. [PDF]

Sci Rep
Qu RN, Li DS, Pan L, Xin J, Qi W, Qin QH.   +5 more
europepmc   +1 more source

Enhancing sustainability in soldering: effects of recycled welding slag and rice husk ash on microstructural, thermal, and mechanical properties of Sn-Cu composite solders. [PDF]

Sci Rep
Soliman HN, Gassour H, Morsy M, Elzwawy A, Amin M, Ali M.   +5 more
europepmc   +1 more source

Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration. [PDF]

Materials (Basel)
Liu C, Liu T, Huang Z, Li X, Zheng J, Li G, Wang G, Liu W, Liu C.   +8 more
europepmc   +1 more source

First-principles study on elastic properties of Cu, (Cu_1- <i>_x</i> ,Ni <i>_x</i> )₃Sn and interfacial mechanical properties of (Cu_1- <i>_x</i> ,Ni <i>_x</i> )₃Sn/Cu in the lead-free solder joint. [PDF]

Beilstein J Nanotechnol
Hua G.
europepmc   +1 more source

Thermal/Mechanical Characteristics Simulation Analysis of Solder Layer Damage in IGBT Modules. [PDF]

Micromachines (Basel)
Zhou J, Chen J, He L, Tang H, Wu X.
europepmc   +1 more source

Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]

Materials (Basel)
Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
europepmc   +1 more source

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]

J Mater Sci
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc   +1 more source

Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]

J Mater Sci Mater Electron
Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM.   +4 more
europepmc   +1 more source