Results 161 to 170 of about 3,856 (291)

Investigation of Oxygen‐Free Wetting Behavior of Aluminum on Copper via Molecular Dynamics Simulations and Experiments

Advanced Engineering Materials, Volume 28, Issue 12, 17 June 2026.
The wettability of aluminum droplets (Al) on different copper substrates (Cu), where liquid Al spreads on solid Cu surfaces to form a liquid–solid interface, is studied numerically and experimentally. The experimental and numerical results show good agreement in the fast‐spreading regime.
Shan Lyu, Timon Steinhoff, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Christian Klose, Ludger Overmeyer, Hans‐Jürgen Maier, Nina Merkert   +8 more
wiley   +1 more source

Effects of Al Element on the Microstructure and Properties of Sn-9Zn Solder Alloy. [PDF]

Materials (Basel)
Yang J, You Y, Jiang G, Li C.
europepmc   +1 more source

Sustainable Photovoltaics: Optimising Material Consumption, Cost and Environmental Performance Through Smart Sustainability Approaches for Crystalline Silicon Solar Photovoltaics

Solar RRL, Volume 10, Issue 11, 15 June 2026.
A sustainability framework shows that photovoltaics can simultaneously improve material security, reduce costs, and improve environmental performance. Updated learning curves reveal declining material intensity and emissions alongside rising energy return on investment, EROI (> 25).
Moonyong Kim, Catherine Chan, Li Wang, Hasret Sahin, Bruno Vicari Stefani, Nathan Chang, Ran Chen, Christian Breyer, Brett Hallam   +8 more
wiley   +1 more source

Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

, 2018
In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated.
Jiang, J. J., Song, Z. L., Hu, F. Q., Zhang, Q. K.   +3 more
core  

Cerium as corrosion inhibitor for Sn-3Ag-0.5Cu solder alloy in 3.5% NaCl solution. [PDF]

Sci Rep
Vani R, Kumar G, Sharma S, Hegde A.
europepmc   +1 more source

Metamaterial Antennas Enhance MRI of the Eye and Occipital Brain

Advanced Materials, Volume 38, Issue 32, 8 June 2026.
A radiofrequency antenna platform comprising planar and bend configurations is developed, incorporating structurally integrated epsilon‐negative metamaterial unit cells to enhance MRI. These antennas enable high‐resolution in vivo human MRI of the eye, orbit, and occipital brain. Comprehensive validation, including simulations, phantom experiments, SAR,
Nandita Saha, Bilguun Nurzed, Mostafa Berangi, Andre Kuehne, Helmar Waiczies, Igor Fabian Tellez Ceja, Xiang Hu, Thomas Gladytz, Lisa Krenz, Dave Huebler, Beate Endemann, Claudia Brockmann, Ebba Beller, Oliver Stachs, Thoralf Niendorf   +14 more
wiley   +1 more source

Electrochemical migration behavior of SnAgCuNi solder alloy in a simulated dew condensation environment. [PDF]

RSC Adv
Wang L, Liu X, Zhao Z, Song J, Shu Y, Wang H, Tan Y, Zhang H, Wang H, Wu J, Xiao K.   +10 more
europepmc   +1 more source

Smart Closed‐Loop Systems in Personalized Healthcare: Advances and Outlook

Advanced Materials Technologies, Volume 11, Issue 12, 18 June 2026.
A smart closed‐loop e‐textile integrates multimodal sensing, onboard processing, wireless communication, and wearable power to enable real‐time physiological/biochemical monitoring and feedback‐controlled therapy. ABSTRACT Smart textiles represent a revolutionary frontier in healthcare, seamlessly blending fabric and advanced technologies to create ...
Safoora Khosravi, Sang Won Lee, Mohammad Abrar Uddin, Sina Hassanpoor, Neha Suvindran, Katherine Le, Harun Arkaz, Harishkumar Narayana, Saeid Soltanian, Danial Khorsandi, Negar Hosseinzadeh Kouchehbaghi, Taeil Kim, Yangzhi Zhu   +12 more
wiley   +1 more source

Lead-free Solder

, 2001
A Sn—Ag—Cu eutectic alloy is modified with one or more low level and low cost alloy additions to enhance high temperature microstructural stability and thermal-mechanical fatigue strength without decreasing solderability.
Terpstra, Robert, Anderson, Iver
core  

Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]

Materials (Basel)
Jeyeselan L, Mhd Noor EE.
europepmc   +1 more source