Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]
Ju YM +5 more
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Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review. [PDF]
Wu G +4 more
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Wettability Study of Soldered Joints in SiC Ceramics and Combined Ni-SiC Using SnSbTi-Based Solder and Electron Beam Heating. [PDF]
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Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C. [PDF]
Wang CH, Li YH.
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Process Parameter Optimization and Crack Formation Mechanism of Femtosecond Laser Welding of Fused Silica/6061 Aluminum Alloy. [PDF]
Li D +8 more
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Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling. [PDF]
Cui C +8 more
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Successful presoldering of nonnoble alloys is variable at best. Under controlled conditions of joint gap distance, investing, and soldering, more than one third of the soldered joints are likely to fail. Furthermore, the recorded strength of successful solder joints was inconsistent.
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ABSTRACT On-demand webinar originally hosted by SMTA Oregon Chapter Technical Presentation: The MIL/AERO industry continues to use SnPb solder for SMT component attachment ...
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Solder joints on rustless alloys
The Journal of the American Dental Association, 1959Passivation is a method of restoring the continuity of the oxide film on metal surfaces in order to reduce corrosion. Nickelchromium alloys should be chemically or electrically passivated before these alloys are soldered. Wherever possible, soldered nickel-chromium alloys should be scrubbed mechanically, dried and set aside to be passivated ...
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