Results 171 to 180 of about 398,038 (255)

Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering. [PDF]

Materials (Basel)
Kang D, Seong H, Yoon J, Sung M, Joo J, Yoon J, Jung S.   +6 more
europepmc   +1 more source

Ultrasonic-assisted soldering of 7075 Al alloy joint using Ni mesh reinforced SAC305 composite solder: microstructure, bonding ratio, and mechanical properties. [PDF]

Ultrason Sonochem
Li D, Xiao Y, Zhang Y, Zhao Y, Zhang J, Luo D.   +5 more
europepmc   +1 more source

Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys. [PDF]

Materials (Basel)
Jiang W, Wang C, Han K, Zhu Y, Hou C, Xing R.   +5 more
europepmc   +1 more source

Ceramic-Integrated Eddy Current Sensor for Blade Tip Clearance Measurement: Design and Performance Evaluation. [PDF]

Sensors (Basel)
Miao Q, Liu Z, Liu Q.
europepmc   +1 more source

Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps. [PDF]

Materials (Basel)
Park HS, Na CY, Kim JW, Jung WS, Park JH, Lim JW, Yang YG.   +6 more
europepmc   +1 more source

Cryogenic Materials for Use in High-Radiation and Low-Magnetic-Field Environments. [PDF]

Materials (Basel)
Korobkina E, Reid A, Hickman C, Tam M, Golio S, Teander C, Huffman P, Rao T, Mahale T, Golub R.   +9 more
europepmc   +1 more source

Quality, Microstructure and Properties of Metal Alloys (Second Volume). [PDF]

Materials (Basel)
Lipiński T.
europepmc   +1 more source

In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. [PDF]

Materials (Basel)
Nogita K, Tan XF, Zhou J, McDonald SD, Sweatman K, Somidin F, Zeng G, Maeno H, Yasuda K, Gourlay CM.   +9 more
europepmc   +1 more source

Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys. [PDF]

Materials (Basel)
Wang CH, Lin CY.
europepmc   +1 more source

Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder balls. [PDF]

J Mater Sci Mater Electron
Sun S, Li A, Cheng C, Gourlay CM.
europepmc   +1 more source