Results 191 to 200 of about 3,856 (291)

Enhancing sustainability in soldering: effects of recycled welding slag and rice husk ash on microstructural, thermal, and mechanical properties of Sn-Cu composite solders. [PDF]

Sci Rep
Soliman HN, Gassour H, Morsy M, Elzwawy A, Amin M, Ali M.   +5 more
europepmc   +1 more source

New High Precision Measurements of Apollo Samples: 0.3–5 GHz Complex Refractive Indices

Journal of Geophysical Research: Planets, Volume 131, Issue 6, June 2026.
Abstract Active and passive radar techniques provide information on the subsurface structure and history of planetary bodies. However, interpretations of radar data are limited by our understanding of the complex dielectric permittivity and magnetic permeability of the surface material.
P. Linton, R. Ghent, P. Gorham, P. Allison, J. J. Beatty, A. Connolly, E. S. Costello, P. Lucey, A. Jung, A. Machtay, K. McBride, C. Miki, E. Oberla, J. Rolla, A. Romero‐Wolf, C. J. Tai Udovicic   +15 more
wiley   +1 more source

Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration. [PDF]

Materials (Basel)
Liu C, Liu T, Huang Z, Li X, Zheng J, Li G, Wang G, Liu W, Liu C.   +8 more
europepmc   +1 more source

Machining Simulation of Recrystallized SiC: Failure Mechanisms, Numerical Influences, Tool Dynamics, and Friction Behavior

Journal of the American Ceramic Society, Volume 109, Issue 6, June 2026.
ABSTRACT This paper presents a comprehensive study on the machining simulation of recrystallized silicon carbide (R‐SiC), with a focus on material failure mechanisms, numerical influences, tool kinematics, and frictional behavior. A representative volume of interest was derived from CT data, and a meshing algorithm for CT‐based structures was ...
Simon Unseld, Stefan Kleiner, Achim Rösiger, Ralf Goller, Dietmar Koch   +4 more
wiley   +1 more source

First-principles study on elastic properties of Cu, (Cu_1- <i>_x</i> ,Ni <i>_x</i> )₃Sn and interfacial mechanical properties of (Cu_1- <i>_x</i> ,Ni <i>_x</i> )₃Sn/Cu in the lead-free solder joint. [PDF]

Beilstein J Nanotechnol
Hua G.
europepmc   +1 more source

A Simplified Technique for the Fabrication of Esthetic and Functional Space Maintainers in Pediatric Dentistry

Journal of Esthetic and Restorative Dentistry, Volume 38, Issue 6, Page 1166-1173, June 2026.
ABSTRACT Introduction Premature loss of primary molars remains a frequent clinical problem in pediatric dentistry and may lead to space loss, occlusal disturbances, and the need for future orthodontic intervention. Conventional space maintainers, such as the band‐and‐loop appliance, are effective in preserving arch length but do not restore occlusal ...
Luciana Duarte Caldas, Anne Vitória de Jesus Ramos, Luísa Schubach da Costa Barreto, Katharina Morant Holanda de Oliveira Vanderlei   +3 more
wiley   +1 more source

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]

J Mater Sci
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc   +1 more source

Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]

Materials (Basel)
Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
europepmc   +1 more source

Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering. [PDF]

Materials (Basel)
Kang D, Seong H, Yoon J, Sung M, Joo J, Yoon J, Jung S.   +6 more
europepmc   +1 more source

Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]

J Mater Sci Mater Electron
Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM.   +4 more
europepmc   +1 more source