Results 191 to 200 of about 398,038 (255)
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Ageing, Solder Thickness and Solder Alloy Effects on Circuit Board Solderability
Circuit World, 1985The paper presents the results of extensive studies on circuit board solderability comparing wetting balance and IPC test methods through performance in vapour phase and wave soldering operations. The effects on solderability of key parameters are examined and compared with storage times of one year, and accelerated ageing using damp heat, dry heat and
J.K. Hagge, G.J. Davis
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Robotic soldering of lead free alloys
2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 2018ABSTRACT The wave soldering process of Electronic Assemblies with lead- free materials has become one of the most expensive factory process to maintain. Cost detractors include: High dross formation of Lead Free materials in the molten wave ...
Kar Lin Chia +5 more
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Post-ceramic soldering of various alloys
The Journal of Prosthetic Dentistry, 1982A base metal alloy was soldered to precious and semiprecious alloys using a post-ceramic soldering technique. The specimens were tested by the tensile mode and the results statistically analyzed. The solder joints involving the base metal had strengths comparable to the precious and semiprecious joints.
R M, Sloan, M H, Reisbick, J D, Preston
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Post-soldering of nonprecious alloys
The Journal of Prosthetic Dentistry, 1980A repeatable post-soldering technique for a nonprecious alloy has been described. With proper metal design, nonprecious alloy crowns can be soldered in a standard vacuum porcelain furnace. Scanning electron micrographs and EDXA confirm that a good union has taken place between the gold solder and nickel alloy.
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Powder solders for hard soldering of aluminium and its alloys
Welding International, 2011Nowadays, aluminium and its alloys are successfully joined using various welding methods in many fields of technology.
Zbigniew Mirski +2 more
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Criteria for Solder Alloy Adoption
SMTA International, 2021ABSTRACT Solder is a critical component in modern electronic systems – past, present, and future. While solder is used within packaged electrical devices, the highest volume of solder is used for en-masse fabrication of printed circuit board assemblies.
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The gold solder, gold alloy interface
Australian Dental Journal, 1977Abstract— With soldering the physical properties of the basis metal must be maintained and a minimum of molten metal is used. An examination of joints in 17 gauge platinized gold wire is made with 18 k gold solder following quenching immediately after flow and cooling in air; there is a widening of grain boundaries and intergranulation penetration in ...
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Reflow soldering evaluation of lead free solder alloys
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 2002A quantitative dynamic solder wettability measurement was used to evaluate the effects of reflow processing on the wettability parameters associated with the nonlead bearing solders 96.5% Sn/3.5% Ag and 58% Bi/42% Sn. An experimental design approach employing full factorial experiments was formulated to investigate the solder wetting dependence of the ...
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Warpage produced by soldering with dental solders and gold alloys
The Journal of Prosthetic Dentistry, 1954Abstract To summarize the results of all of these trials, it can be said that the more precise the fit of the parts to be soldered, the less they will be distorted.This is true whether the joints considered are of wires or of bars. The amount of solder used to produce the joint is important.The less solder used to produce the union, the less the ...
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Effect of Nd addition on the corrosion behavior of SAC305 solder alloy
Corrosion Science, 2023Kui Xiao, Xiejing Luo, Pan Yi
exaly