Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste. [PDF]
Nano ConvergJu YM +5 more
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Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys. [PDF]
Materials (Basel)Wang CH, Lin CY.
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Wettability Study of Soldered Joints in SiC Ceramics and Combined Ni-SiC Using SnSbTi-Based Solder and Electron Beam Heating. [PDF]
Materials (Basel)Melus T +6 more
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Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C. [PDF]
Materials (Basel)Wang CH, Li YH.
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Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight. [PDF]
Materials (Basel)Zhang X, Gao J, Zhang L.
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ESPiezometer: ESP32-based field tool for installation and validation of piezometric sensors for groundwater level monitoring. [PDF]
HardwareXBlanco-Jáquez AD +4 more
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Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review. [PDF]
Micromachines (Basel)Wu G +4 more
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Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates. [PDF]
Materials (Basel)Koleňák R +4 more
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Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review. [PDF]
Materials (Basel)Choi H, Illés B, Dušek K.
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