Results 231 to 240 of about 3,856 (291)
Some of the next articles are maybe not open access.
The Journal of Prosthetic Dentistry, 1983
Successful presoldering of nonnoble alloys is variable at best. Under controlled conditions of joint gap distance, investing, and soldering, more than one third of the soldered joints are likely to fail. Furthermore, the recorded strength of successful solder joints was inconsistent.
L W, Townsend +2 more
openaire +2 more sources
Successful presoldering of nonnoble alloys is variable at best. Under controlled conditions of joint gap distance, investing, and soldering, more than one third of the soldered joints are likely to fail. Furthermore, the recorded strength of successful solder joints was inconsistent.
L W, Townsend +2 more
openaire +2 more sources
Solder joints on rustless alloys
The Journal of the American Dental Association, 1959Passivation is a method of restoring the continuity of the oxide film on metal surfaces in order to reduce corrosion. Nickelchromium alloys should be chemically or electrically passivated before these alloys are soldered. Wherever possible, soldered nickel-chromium alloys should be scrubbed mechanically, dried and set aside to be passivated ...
S M, BIEN, H D, AYERS
openaire +2 more sources
Ageing, Solder Thickness and Solder Alloy Effects on Circuit Board Solderability
Circuit World, 1985The paper presents the results of extensive studies on circuit board solderability comparing wetting balance and IPC test methods through performance in vapour phase and wave soldering operations. The effects on solderability of key parameters are examined and compared with storage times of one year, and accelerated ageing using damp heat, dry heat and
J.K. Hagge, G.J. Davis
openaire +1 more source
Robotic soldering of lead free alloys
2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 2018ABSTRACT The wave soldering process of Electronic Assemblies with lead- free materials has become one of the most expensive factory process to maintain. Cost detractors include: High dross formation of Lead Free materials in the molten wave ...
Kar Lin Chia +5 more
openaire +1 more source
Post-ceramic soldering of various alloys
The Journal of Prosthetic Dentistry, 1982A base metal alloy was soldered to precious and semiprecious alloys using a post-ceramic soldering technique. The specimens were tested by the tensile mode and the results statistically analyzed. The solder joints involving the base metal had strengths comparable to the precious and semiprecious joints.
R M, Sloan, M H, Reisbick, J D, Preston
openaire +2 more sources
Powder solders for hard soldering of aluminium and its alloys
Welding International, 2011Nowadays, aluminium and its alloys are successfully joined using various welding methods in many fields of technology.
Zbigniew Mirski +2 more
openaire +1 more source
Post-soldering of nonprecious alloys
The Journal of Prosthetic Dentistry, 1980A repeatable post-soldering technique for a nonprecious alloy has been described. With proper metal design, nonprecious alloy crowns can be soldered in a standard vacuum porcelain furnace. Scanning electron micrographs and EDXA confirm that a good union has taken place between the gold solder and nickel alloy.
openaire +2 more sources
Criteria for Solder Alloy Adoption
SMTA International, 2021ABSTRACT Solder is a critical component in modern electronic systems – past, present, and future. While solder is used within packaged electrical devices, the highest volume of solder is used for en-masse fabrication of printed circuit board assemblies.
openaire +1 more source
A Viscoplasticity Model for Solder Alloys
Volume 4: Electronics and Photonics, 2010Demand for long-term reliability of electronic packaging has lead to a large number of studies on visco-plastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where dislocation motion and diffusion processes are taken into account.
Yongchang Lee, Cemal Basaran
openaire +1 more source
Phase evolution of solder alloys
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), 2011In-situ X-ray diffraction (XRD) measurements applying synchrotron radiation were realized to evaluate microstructure evolution of 95.5Sn3.8Ag0.7Cu (wt. %), 99Sn1Cu (wt. %) and 96Sn4Ag (wt. %) lead-free solder alloys during heating (30–250°C), isothermal annealing (250°C) and cooling (250–30°C).
Alena Pietrikova, Juraj Durisin
openaire +1 more source