Results 71 to 80 of about 398,038 (255)
Materials & DesignAluminum alloy liquid-cooled plates are the most widely used heat management technology in high-end servers and aerospace thermal control systems. Due to the natural oxidation layer, welding and effective connection of aluminum alloys are still difficult,
Ruofan Wang +4 more
doaj +1 more source
Advances in Materials Science and Engineering, 2017 The wettability of copper substrates by Sn-Zn eutectic solder alloy doped with 0, 0.5, 1, and 1.5 at.% of indium was studied using the sessile drop method, with flux, in air, at 250°C and reflow time of 3, 8, 15, 30, and 60 min.
Janusz Pstruś +2 more
doaj +1 more source
Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]
, 2021 Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
core
A Full Physical Strategy for Electrical Contacts on Laser‐Induced Graphene (LIG) Electrodes
Advanced Electronic Materials, EarlyView.A fully dry fabrication strategy combining PVD and dual‐laser processing enables direct integration of laser‐induced graphene with metallic current collectors. Ultralow Au‐LIG contact resistance is achieved without binders, adhesives, or chemical treatments, while preserving electrochemical performance.
Davide Arcoraci +9 more
wiley +1 more source
Advanced Electronic Materials, EarlyView.A compact resistively loaded metamaterial absorber captures RF energy at 2.4 GHz and directs most of the accepted power to modeled loads. The resonant response is confirmed experimentally for the fabricated absorber, while an impedance‐matched rectifier is evaluated through simulation. The stage‐wise results distinguish absorber, rectifier, and cascade
Md. Murad Kabir Nipun, Md. Jahedul Islam
wiley +1 more source
Preparation and Property of SnXCuNiBi Solder Alloy
, 2010 Lead-free solder is meeting the requirement of environmental protection, but the property performance of existing lead-free solder is hardly comparable to those of lead solder.
Yu Long Chen +4 more
core +1 more source
Harnessing the VO2 Phase Transition for Automatic Gain Control in Transimpedance Amplifiers
Advanced Electronic Materials, EarlyView.A nanoscale VO2‐based volatile switch integrated into a transimpedance‐amplifier feedback loop dynamically lowers gain when input current rises, preventing saturation and extending dynamic range. Rapid self‐recovery restores high sensitivity without external reset circuitry.
Amir Gildor +3 more
wiley +1 more source
Journal of Materials Research and TechnologyThis essay aims to comparatively study the microscopic morphology and grinding properties of brazed diamonds with amorphous and crystalline filler alloy in the case of rare-earth Nd-doped modified Ni-based filler alloy.
Tian Jin +6 more
doaj +1 more source
Advanced Intelligent Systems, EarlyView.A hybrid mobile robot with a modular Variable‐Stiffness Bridge transitions between a rigid locomotion platform and a flexible, shape‐conforming body. By enclosing objects within its deformable structure rather than relying on dedicated end effectors, the robot achieves orientation‐regulated planar transport, with conformal contact quality shown to ...
Luiza Labazanova +5 more
wiley +1 more source
Thermally Drawn Bioelectric Catheters: Enabling Proprioceptive Endovascular Navigation
Advanced Intelligent Systems, EarlyView.This work introduces a novel bioelectric navigation system eliminates the need for harmful fluoroscopy during endovascular surgeries. A bespoke 16‐electrode catheter is fabricated using rapid thermal drawing and laser micro‐machining. Paired with a real‐time tracking algorithm fusing vascular geometry detection and distance estimation, this technology ...
Alex Ranne +8 more
wiley +1 more source