Results 71 to 80 of about 3,856 (291)

Self‐Soldering, Stretchable and Self‐Healing Liquid Metal Elastomer Interconnections for Soft Electronics Platforms

open access: yesAdvanced Materials Technologies, EarlyView.
A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San   +5 more
wiley   +1 more source

Viscoplastic Deformation of Lead Free Solder Alloy- Experiments and Simulations [PDF]

open access: yes, 2003
In this paper, viscoplastic deformations of Sn-3.5Ag-0.75Cu solder alloy are discussed. First, the following experiments are conducted: (1) Pure tension at several strain rates.
Sasaki, Katsuhiko   +2 more
core  

Whisker Development from SAC0307-Mn07 Solder Alloy [PDF]

open access: yes, 2020
In this study, the whisker growth from SAC0307-Mn07 solder alloy was investigated. To get fast information, an ultra-thin film was vacuum evaporated from the examined solder alloy onto Cu substrates.
Illés, Balázs   +4 more
core  

Effect of Mixed Rare Earths on the Wetting Behavior and Interfacial Reaction between Sn-0.70Cu-0.05Ni Solder and Amorphous Fe84.3Si0.3B5.4 Alloy

open access: yesMATEC Web of Conferences, 2018
In order to explore the effect of addition of mixed rare earths (MRE) on the wetting behavior and interfacial reaction between Sn-0.70Cu-0.05Ni solder and amorphous Fe84.3Si10.3B5.4 alloy, 0.25 wt.% percentage of the MRE, which are mainly elements La and
Hou Bin   +5 more
doaj   +1 more source

Fully 3D‐Printed Wave‐Wound Electromagnetic Motors

open access: yesAdvanced Materials Technologies, EarlyView.
This work presents the first fully 3D‐printed wave‐wound electromagnetic motors, which are created using conductive nanoparticle inks, carbon‐filled nylon polymers, and surface mount components. These motors can achieve a stall torque of 7.62N·mmA−1$7.62 \nobreakspace N{\cdot }mm A^{-1}$ and efficiency of 28.2 %, which approaches the performance of ...
Joseph Schwalbe   +4 more
wiley   +1 more source

Miniaturized Bidirectional Thermal Stimulation System Integrated With an Electrode Array for Recording Neural Activities

open access: yesAdvanced Science, EarlyView.
This study presents a miniaturized bidirectional thermal stimulation system integrated with an electrode array enabling real‐time, bidirectional modulation and simultaneous recording of neural activity through localized heating and cooling. By monolithic integration of the Peltier element and with a silicon neural probe, the innovative system allows ...
Zoia Naumkina   +6 more
wiley   +1 more source

Soldering Characteristics And Corrosion Behaviour Of Indium Added To SAC305 Solder Alloy [PDF]

open access: yes, 2018
Alloying element indium is chosen in order to study the effects of indium tocorrosion resistance of Sn-Ag-Cu solder alloy. In this project, the composition of indium was varied ranging from 1-4 wt. % and were added into Sn–3.0Ag-0.5Cu solder.
Amiruddin, Atikah Zulaikha
core  

Temporal Interference Stimulation Enhances Neural Regeneration

open access: yesAdvanced Science, EarlyView.
Temporal interference (TI) stimulation is proposed as a non‐invasive approach to enhance neural regeneration in the deep brain. Theta‐band TI modulation selectively promotes neural progenitor cell differentiation in vitro and augments hippocampal neurogenesis in amouse model of Alzheimer's disease‐like amyloidosis.
Sofia Peressotti   +15 more
wiley   +1 more source

Temperature‐Resilient Reconfigurable Physical Unclonable Function Driven by Pulse Modulation Using CMOS‐Integrated Spintronic Chips

open access: yesAdvanced Science, EarlyView.
A reconfigurable physical unclonable function is developed using CMOS‐integrated SOT‐MRAM chips, leveraging a dual‐pulse strategy and offering enhanced environmental robustness. A temperature‐compensation effect arising from the CMOS transistor and SOT‐MTJ is revealed and established as a key prerequisite for thermal resilience.
Min Wang   +7 more
wiley   +1 more source

Comparative Tensile Strengths of Preceramic and Postceramic Solder Connectors Using High-Palladium Alloy

open access: yes, 2004
Purpose: To evaluate the tensile strength properties of Rx Naturelle Plus and Option (high-palladium) alloys on soldered connectors under simulated preceramic and postceramic soldering conditions.
Shehab, Abdul-Hadi
core   +1 more source

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