Results 51 to 60 of about 6,013,042 (268)
Design and steps to implementation of lead-free manufacturing [PDF]
Plan BLead is no longer used in paints or gasoline due to the harmful effects caused from internal consumption and inhalation of lead. Unfortunately, the steps taken to reduce or control the harmful usage of lead in these cases were a reactive rather ...
Her, Cal F.
core
Accelerated testing methodology for lead-free solder interconnects
The purpose of accelerated testing is to provoke the same failure in a product during the test as it occurs in the real world but in shorter time than in the application.
Grossmann, G. (author)
core +1 more source
Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure.
Jinhua Mi +4 more
doaj +1 more source
Fire smoke could induce serious corrosion damage to electronic equipment away from the fire, causing significant economic losses. And lead-free solders used for chip package is the key to ensure the reliability of electronic equipment, which is ...
Qian Li +3 more
doaj +1 more source
Differential Tissue‐Coupled Powering for Battery‐Free Injectable Electroceuticals
A thread‐like injectable neural stimulator is powered through differential tissue‐coupled powering (DTCP), which harvests RF‐frequency tissue potentials with an elongated receiver while preserving a injectable cross‐section. The system integrates an ASIC, stimulation electrodes, and a portable transmitter, enabling wireless peripheral nerve stimulation,
Han Wu +13 more
wiley +1 more source
Comparison of creep behavior for lead free solders Sn-3.5Ag, SAC305 and SAC387
Numerous lead-free solder compositions were developed recently to substitute the conventional lead-tin solder due to its environmental hazards. As an example, lead-free solders with tin-silver-copper (SAC) compositions are frequently used with various ...
Ramiro Vargas, Viktor Gonda
doaj
Wettability study of lead free solder paste and its effect towards multiple reflow
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder ...
Idris Siti Rabiatull Aisha +2 more
doaj +1 more source
A pneumatic energy‐buffering strategy transforms transient and intermittent footsteps into quasi‐continuous electrical energy for a self‐powered wearable biosensing platform. The footwear‐integrated air‐pumping harvester, combined with the rationally designed power‐management system, powers a wearable ankle PPG device with reduced motion artifacts ...
Ji‐Seok Kim +8 more
wiley +1 more source
Correlation Between Pin Misalignment and Crack Length in THT Solder Joints
In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys.
Molnar A., Benke M., Gacsi Z.
doaj +1 more source
An innovative hybrid passive cooler integrates a porous radiative coating and an atmospheric moisture‐harvesting hydrogel within a melamine sponge skeleton, synergizing radiative cooling, sensible‐heat absorption, and latent‐heat evaporation. It maintains an average 8.3°C sub‐ambient cooling under sunlight and a maximum ∼42.4°C drop under 2000 W·m−2 ...
Qingyuan Du +6 more
wiley +1 more source

