Results 51 to 60 of about 8,512 (299)
Advances in Magnesium‐Based Thermoelectrics: A Critical Review
Advanced Materials, EarlyView.Magnesium‐based thermoelectric materials have emerged as promising candidates for low‐to‐mid‐temperature energy conversion due to their abundance, low cost, and competitive performance. This review summarizes recent advances in Mg3X2, MgAgSb, and Mg2X systems, covering transport mechanisms, fabrication strategies, stability challenges, and device ...
Li‐Min Zhang +5 more
wiley +1 more source
Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
The Scientific World Journal, 2014 Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure.
Jinhua Mi +4 more
doaj +1 more source
Advanced Materials, EarlyView.Ultrathin lithium metal anodes (≤15 µm) offer a promising route to high‐energy‐density batteries due to their high capacity and low potential. This review presents design principles for ultrathin Li, evaluates fabrication strategies, and discusses challenges in liquid and solid‐state cells.
Cheng Wang +9 more
wiley +1 more source
Wettability study of lead free solder paste and its effect towards multiple reflow
MATEC Web of Conferences, 2016 Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder ...
Idris Siti Rabiatull Aisha +2 more
doaj +1 more source
Thermomechanical Stress of Lead Free Solder Joint
, 2011 This diploma thesis deals with the reliability of lead-free solder joints at a different interconnection structures. The first goal is to design the test cases shape BGA (FC) for testing the strength of lead-free solder joints at shear test in link with ...
Libich, Jiří
core +2 more sources
Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles
Advanced Materials, EarlyView.Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung +9 more
wiley +1 more source
Correlation Between Pin Misalignment and Crack Length in THT Solder Joints
Archives of Metallurgy and Materials, 2017 In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys.
Molnar A., Benke M., Gacsi Z.
doaj +1 more source
, 2013 Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area.
Bhatti, Raj +5 more
core +1 more source
Advanced Materials, EarlyView.A double‐sided mechanical interlocking strategy is developed to create robust electrical contact between polymer electrode and metal interconnect. The fibrous structure enables formation of thread–hole adhesion, which only breaks under bulk failure and achieves a record high interfacial energy exceeding 730 J·m−2. This adhesion secures the integrity of
Gang Li +6 more
wiley +1 more source
Advanced Materials Technologies, EarlyView.Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack +15 more
wiley +1 more source