Results 201 to 210 of about 209,537 (392)

An Electrode Design Strategy to Minimize Ferroelectric Imprint Effect

open access: yesAdvanced Science, EarlyView.
A tunable electrode design using La0.7Sr0.3MnO3 enables precise modulation of ferroelectric imprint through oxygen pressure–controlled work function engineering. By applying this strategy to both perovskite and fluorite systems, the built‐in field is effectively suppressed, enabling low‐voltage, high‐endurance ferroelectric devices, including Fe‐FETs ...
Yu‐Wei Chen   +11 more
wiley   +1 more source

Moisture Harvesting by the Structure Regulation of Hygroscopic Hydrogel for Energy and Water Sustainability

open access: yesAdvanced Electronic Materials, EarlyView.
Hygroscopic hydrogels are capable of utilizing the moisture from air, which can transfer the gaseous water to liquid by a surface phase transition. Taking advantage of this water, sustainable water production, thermal management, and electricity generation can be realized.
Yujie Du   +5 more
wiley   +1 more source

Acid Phosphatase from Mung Bean Sprouts Part I

open access: bronze, 1969
Kazunari Hagiwara   +2 more
openalex   +2 more sources

Electronic Nanomaterials for Plants: A Review on Current Advances and Future Prospects

open access: yesAdvanced Electronic Materials, EarlyView.
Global food security faces mounting challenges from climate change and rapid population growth. This review highlights the pivotal role of electronic nanomaterials–including metals, metal oxides, and carbon‐based structures–in enhancing plant photosynthesis, nutrient uptake, and stress resilience. Furthermore, it explores how emerging platforms such as
Ciro Allará   +8 more
wiley   +1 more source

An Adenosine Hydrolase from Brussels Sprouts

open access: hybrid, 1963
Mendel Mazelis, Richard K. Creveling
openalex   +1 more source

Vegfc acts through ERK to induce sprouting and differentiation of trunk lymphatic progenitors

open access: yesDevelopment, 2016
M. Shin   +6 more
semanticscholar   +1 more source

Effect of Added Ni Nanoparticles on the Microstructure and Mechanical Properties of Sn58Bi/Cu Solder Joints under Thermal Shock Conditions

open access: yesAdvanced Electronic Materials, EarlyView.
This article concludes that the microstructure as well as grain coarsening is suppressed and the growth of IMC layer is promoted in Sn58Bi/Cu solder joints versus Sn58Bi‐0.6 Ni/Cu solder joints after 1200 thermal shock experiments, while the mechanical properties of the solder joints are improved.
Jiamin Zhang   +4 more
wiley   +1 more source

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