Results 201 to 210 of about 389,974 (331)
Broad Beam Plasma Enhanced Low-Temperature Growth of Oriented Aluminum Nitride Thin Films. [PDF]
Liu Y +8 more
europepmc +1 more source
The article reviews laser‐processed carbons from various precursors, processing mechanism and their application in advanced batteries. The laser process is chemical free, fast, and scalable, enabling improved battery performance and stability for Li, Na, and Zn battery technologies.
Sujit Deshmukh +2 more
wiley +1 more source
High power impulse magnetron sputtering discharge
J. Gudmundsson +3 more
semanticscholar +1 more source
Enhanced optical trapping by concentrated local fields in metallic semi-continuous films. [PDF]
Liu C, Huang Z, Zhang Y, Nan F, Lei H.
europepmc +1 more source
Colloidal Crack Sintering Lithography for Light‐Induced Patterning of Particle Assemblies
Colloidal crack sintering lithography (CCSL) is a microfabrication technique that uses light‐induced photothermal heating to trigger sintering and controlled cracking in polymer colloidal assemblies. Local structural changes generate microchannels and patterns, enabling direct writing of diverse topographic motifs.
Marius Schoettle +2 more
wiley +1 more source
Molecular dynamics simulations of the sputtering of boron and boron oxide surfaces. [PDF]
Shermukhamedov S +3 more
europepmc +1 more source
The concept of foulant particle manipulation and detachment from active microfiltration membranes via voltage‐driven vibrations is introduced. Actuator components are initially integrated onto the filtration membranes using an airbrush spray printing technique.
Irem Gurbuz, Hanieh Bazyar, Andres Hunt
wiley +1 more source
Argon Ion Treatment of Multi-Material Layered Surface-Electrode Traps for Noise Mitigation. [PDF]
Palani D +7 more
europepmc +1 more source
Melt Grafting of Geometry‐Tailored Voltage Stabilizers for High‐Performance Polypropylene Insulation
A scalable one‐step melt grafting strategy is developed to enhance the dielectric properties of isotactic polypropylene by covalently incorporating thermally stable aromatic voltage stabilizers. This solvent‐free approach improves volume resistivity and DC breakdown strength through deep trap formation and charge localization, offering a sustainable ...
Nazirul Mubin bin Normansah +9 more
wiley +1 more source
Influence of deposition conditions on ALD based Ru passivation for Cu-Cu hybrid bonding. [PDF]
Park SW, Han H, Ahn CW, Park JK.
europepmc +1 more source

