Results 11 to 20 of about 133,007 (263)
Influence of Interface Thermal Resistance on Relaxation Dynamics of Metal-Dielectric Nanocomposite Materials under Ultrafast Pulse Laser Excitation [PDF]
Nanocomposite materials, including noble metal nanoparticles embedded in a dielectric host medium, are interesting because of their optical properties linked to surface plasmon resonance phenomena.
M. Rashidi Huyeh, N. Moosavinejad
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Temperature rise in multi-junction solar cells reduces their efficiency and shortens their lifetime. We report the results of the feasibility study of passive thermal management of concentrated multi-junction solar cells with the non-curing graphene ...
Barath Kanna Mahadevan +3 more
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Research Progress of Advanced Thermal Management Materials
Thermal management systems, controlling the dispersion, storage and conversion of heat, were widely used in various fields of national economy and defence applications etc.
HE Peng, GENG Hui-yuan
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Heat-pipe-cooled thermal protection is an effective thermal protection method with embedded high heat transfer capacity materials or structures. A numerical model of a heat-pipe-cooled thermal protection structure with an embedded high thermal conduc ...
LIU Dong-huan +2 more
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Thermal Properties of Graphene: Applications in Thermal Interface Materials [PDF]
Abstract not Available.
Khan M. Shahil +2 more
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Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power ...
Peijia Chen +5 more
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Hexagonal boron nitride and silicone rubber (h-BN/SR) composites were prepared by the mechanical stirring method, and their crystal morphology, chemical structure, thermal properties, and compression stress–strain performance were investigated.
Yafang Zhang +5 more
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Thermal Interface Materials [PDF]
Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink.
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To develop high-performance thermoelectric devices that can be created using printing technology, the interface of a composite material composed of MASnI3 and Bi2Te3, which individually show excellent thermoelectric performance, was studied based on ...
Masayuki Morimoto +5 more
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Graphene Thermal Interface Materials [PDF]
Abstract not Available.
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