Results 21 to 30 of about 648,950 (298)
Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power ...
Peijia Chen +5 more
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Thermal Interface Materials [PDF]
Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink.
openaire +1 more source
To develop high-performance thermoelectric devices that can be created using printing technology, the interface of a composite material composed of MASnI3 and Bi2Te3, which individually show excellent thermoelectric performance, was studied based on ...
Masayuki Morimoto +5 more
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Hexagonal boron nitride and silicone rubber (h-BN/SR) composites were prepared by the mechanical stirring method, and their crystal morphology, chemical structure, thermal properties, and compression stress–strain performance were investigated.
Yafang Zhang +5 more
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Formation and X-ray emission from Hot Bubbles in Planetary Nebulae. I. Hot Bubble formation [PDF]
We carry out high resolution two-dimensional radiation-hydrodynamic numerical simulations to study the formation and evolution of hot bubbles inside planetary nebulae (PNe).
Arthur, S. J., Toalá, J. A.
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Recent Advances in Thermal Interface Materials [PDF]
2.Yongcun Zhou, Siqi Wu,Yuheng Long, Pengli Zhu, Feixiang Wu, Feng Liu,Vignesh Murugadoss, Williams Winchester, Amit Nautiyal, Zhe Wangand Zhanhu Guo,Recent Advances in Thermal Interface Materials,ES Mater. Manuf.., 2020,7, 4-24.DOI: doi.org/10.30919/esmm5f717 In recent years, miniaturization and integration have become the development trends of ...
Yongcun Zhou +10 more
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This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were employed,
Syunsuke MURAOKA +4 more
doaj +1 more source
Assessment of the Thermal Conductivity of BN-C Nanostructures [PDF]
Chemical and structural diversity present in hexagonal boron nitride ((h-BN) and graphene hybrid nanostructures provide new avenues for tuning various properties for their technological applications.
Cagin, Tahir +3 more
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Graphene–graphite hybrid epoxy composites with controllable workability for thermal management
The substantial heat generation in highly dense electronic devices requires the use of materials tailored to facilitate efficient thermal management.
Idan Levy +5 more
doaj +1 more source
On the exclusion of intra-cluster plasma from AGN-blown bubbles [PDF]
Simple arguments suggest that magnetic fields should be aligned tangentially to the surface of an AGN-blown bubble. If this is the case, charged particles from the fully ionised intra-cluster medium (ICM) will be prevented, ordinarily, from crossing the ...
Baumjohann +54 more
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