Results 21 to 30 of about 8,274,419 (297)
Characterization of thermal interface materials to support thermal simulation
S.145-150In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat.
May, D. +6 more
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To develop high-performance thermoelectric devices that can be created using printing technology, the interface of a composite material composed of MASnI3 and Bi2Te3, which individually show excellent thermoelectric performance, was studied based on ...
Masayuki Morimoto +5 more
doaj +1 more source
Hexagonal boron nitride and silicone rubber (h-BN/SR) composites were prepared by the mechanical stirring method, and their crystal morphology, chemical structure, thermal properties, and compression stress–strain performance were investigated.
Yafang Zhang +5 more
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Thermal Interface Materials [PDF]
Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink.
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A multi-level interface model for damaged masonry [PDF]
The aim of the present work is to propose a new micro-mechanical model in the context of the deductive approach used to derive interface models. This model, based on a previous study introduced previously by A. Rekik and F.
E. Sacco +7 more
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Investigation of thermal transport across volume-controlled thermal interface materials
For thermal management, thermal interface materials are essential to reduce parasitic thermal resistance by filling microscopic gaps at interface. While much of previous research has focused on enhancing the thermal conductivity of the materials, the ...
Jungmin Lee, Woosung Park
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Graphene–graphite hybrid epoxy composites with controllable workability for thermal management
The substantial heat generation in highly dense electronic devices requires the use of materials tailored to facilitate efficient thermal management.
Idan Levy +5 more
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This study investigates the effects of interface edge configuration on the stress distribution near the edge of a ceramics/metal joint system interface using numerical thermal elastoplastic analysis. Finite element bonded dissimilar models were employed,
Syunsuke MURAOKA +4 more
doaj +1 more source
The external influencing factors, the thermal interface material, load-bearing brick weight, and temperature difference, of a thermoelectric generator (TEG) device were experimentally examined.
Chengyu Gu +9 more
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Graphene Thermal Interface Materials [PDF]
Abstract not Available.
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