Results 211 to 220 of about 133,007 (263)

Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

Materials Science Forum, 2020
Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mazlan Mohamed, Mohd Nazri Omar, Mohamad Shaiful Ashrul Ishak, Rozyanty Rahman, Yahaya Nor Zaiazmin, Mohammad Khairul Azhar Abdul Razab, Mohd Zharif Ahmad Thirmizir   +6 more
openaire   +1 more source

Thermal Conductivity of Thermal Interface Materials

MRS Proceedings, 2007
AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of ...
Travis Z. Fullem, Eric J. Cotts
openaire   +1 more source

Performance and testing of thermal interface materials

Microelectronics Journal, 2003
Abstract The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU–heat sink interface. This work provides a state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials ...
J. P. Gwinn, R. L. Webb
openaire   +1 more source

Advanced Thermal Interface Materials

MRS Proceedings, 2006
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs.
Yimin Zhang, Allison Xiao, Jeff McVey
openaire   +1 more source

Characterization of Thermal Interface Materials

2006 1st Electronic Systemintegration Technology Conference, 2006
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data.
Ralph Schacht, Daniel May, Bernhard Wunderle, Olaf Wittler, Astrid Gollhardt, Bernd Michel, Herbert Reichl   +6 more
openaire   +1 more source

Thermal Interface Materials

2009
Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling ...
Ravi Prasher, Chia-Pin Chiu
openaire   +1 more source

Electrical and Thermal Interface Materials

Pan Pacific Symposium, 2008
ABSTRACT Solder is the mainstay of electronics assembly, but many connections need to be made with other materials. This paper addresses the performance of the latest generation of two of these: thermally and electrically conductive materials.
Rob Emery, Tanawan Chaowasakoo
openaire   +1 more source

Engineered thermal interface material

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn-in systems, LED devices, etc. present challenges in cooling. Many types of consumer devices and sensors are proliferating. All these applications require an ongoing improvement in thermal management.
Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois   +10 more
openaire   +1 more source

Electrospinning of thermal interface materials

Advances in Colloid and Interface Science
As electronic systems continue to evolve toward higher integration and power densities, the demand for efficient thermal interface materials (TIMs) grows increasingly urgent. Electrospinning has emerged as a versatile and scalable approach for fabricating TIMs with tunable nanofiber architectures and tailored interfacial properties.
Xiachen, Xiao, Baoshan, Xie, Liangxuan, Ouyang, Juefei, Yang, Chengshuai, Li, Jing, Zhao, Youfu, Lv, Xiaoliang, Zeng, Chuanchang, Li   +8 more
openaire   +2 more sources

Superior thermal interface materials for thermal management

Composites Communications, 2019
Abstract Thermal interface materials (TIMs) have been widely used in various electronic devices and are crucial for next generation electronics such as flexible electronics. Ultrathin full carbon films with extraordinary high thermal conductivity (k) and promising mechanical strength have been well documented, but the brittleness (elongation at break~
Chang Ping Feng, Lu Bai, Rui-Ying Bao, Shi-Wei Wang, Zhengying Liu, Ming-Bo Yang, Jun Chen, Wei Yang   +7 more
openaire   +1 more source