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Thermal Characterizations of Solid Thermal Interface Materials
2008 10th Electronics Packaging Technology Conference, 2008Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materials, including indium, graphite, and fiberglass were conducted. A TIM tester was utilized to measure the
Hengyun Zhang +3 more
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Thermal characterization of thermal interface material bondlines
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended.
T. Z. Fullem +4 more
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Recent Advances in Thermal Interface Materials
World Scientific Annual Review of Functional Materials, 2022Ever-increasing performance and functions of electronic systems are pushing the requirements for heat dissipation of devices at an unprecedented pace. To package individual devices (especially those working in high-power mode), research and development of thermal interface materials (TIMs) have accelerated since the beginning of this century.
Jing Cao +8 more
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Characterization of nanostructured thermal interface materials – A review
International Journal of Thermal Sciences, 2011Abstract Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance ...
Andrew J. McNamara +2 more
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Simultaneous thermal/flow characterization of thermal interface materials
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016Thermal interface materials used for dissipation of heat in electronic assemblies are often exposed to working conditions that may change the mechanical as well as thermal behavior over time due to both intrinsic change as well as environmental influence [1]. Currently, among thermal interface material solutions, particle filled greases are common. For
Y. Singh, N. Bajaj, G. Subbarayan
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The Future of Metal Thermal Interface Materials
Soldering and Reliability Conferences, 2022ABSTRACT This file is a Powerpoint presentation only.
Ron Lasky, Tim Jensen, Michael Dickey
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Thermal Interface Materials Testing
SMTA International, 2009ABSTRACT There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures
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Joint Thermal Resistance and Thermal Interface Materials
2023Heat conduction across a joint of two solids occurs practically in every heat generated system. A significant temperature gradient occurs as heat is transferred by conduction across the joint of two solids. This is due to the thermal contact resistance generated by the surface irregularities.
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Reliability of thermal interface materials: A review
Applied Thermal Engineering, 2013Abstract Thermal interface materials (TIMs) are used extensively to improve thermal conduction across two mating parts. They are particularly crucial in electronics thermal management since excessive junction-to-ambient thermal resistances can cause elevated temperatures which can negatively influence device performance and reliability. Of particular
Jens Due, Anthony J. Robinson
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Joint Healing Thermal Interface Material
International Symposium on Microelectronics, 2016Abstract Today, thermal interface materials (TIM) are widely used between a processor die and an integrated heat-spreader (IHS) to provide a good thermal conduction path for heat transfer from the electronic package. As the current trend towards larger “die size designs” progresses, the performance and reliability of the TIM will be a ...
Jingting Yang +5 more
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