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Thermal Performance and Reliability of Thermal Interface Materials: A Review
7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006Interface thermal resistance minimization has been identified as a critical issue for the thermal management of electronic systems by the NEMI 2004 technology roadmap [1]. In current high-performance air-cooled microelectronic applications, the component-to-heat sink interfacial contact thermal resistance can be comparable to that of the actual heat ...
P. Rodgers +3 more
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Recent progress of thermal interface materials
2008 2nd Electronics Systemintegration Technology Conference, 2008This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced.
J. Liu +3 more
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Challenges in thermal interface material testing
Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006Characterization of thermal properties of thermal interface materials (TIMs) has gained increasing importance as the relative percentage of overall semiconductor package material thermal resistance attributable to the TIMs has increased. The development of new TIM materials has increasingly focused on materials with very high performance and, in ...
Clemens J.M. Lasance +3 more
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Thermal interface tailoring in composite materials
Diamond and Related Materials, 2010The thermal transport in heterogeneous materials systems, such as in composites, is essentially controlled by the phonon scattering phenomena at the materials interface due to the interface materials property mismatch. Such phenomena are also prevalent in joints or component interfaces.
A.K. Roy +5 more
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Graphene-based thermal interface materials
2011 11th IEEE International Conference on Nanotechnology, 2011Thermal management in electronic circuits is becoming an important integral part of design considerations. Increasing power densities and speed of advanced computer chips motivate the search for more efficient thermal interface materials. Here we report preliminary results of experimental and theoretical investigations of the epoxy composites, which ...
Khan M. F. Shahil, Alexander A. Balandin
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Thermal Transfer in Graphene-Interfaced Materials: Contact Resistance and Interface Engineering
ACS Applied Materials & Interfaces, 2013We investigate here heat transfer across interfaces consisting of single- and few-layer graphene sheets between silicon carbides by performing nonequilibrium molecular dynamics simulations. The interfacial thermal conducitivity κI is calculated by considering graphene layers as an interfacial phase.
Hanxiong, Wang +3 more
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Self–healing Thermal Interface Materials
2020Thermal interface materials (TIMs) are widely used as gap–filler materials between electronic devices such as LEDs and ICs and their heat sink and aim to control the heat dissipation and to provide mechanical anchoring. As the rated power densities of electronic devices are increasing rapidly, the TIMS are exposed to higher thermal and mechanical loads.
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THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
Experimental Techniques, 2008C.I. Chen +5 more
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Thermal Interface Materials in the HPC Era
IMAPSource ProceedingsThe high performance computing (HPC) module market is seeing some enormous simultaneous changes. The compute needs of XPU and tensor processors are causing die area to grow, with higher areal power density, and HBM DRAM stacks are now located immediately adjacent to the processor.
Andy C. Mackie, Tim Jensen, David Saums
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