Results 241 to 250 of about 8,274,419 (297)

Formation of nanoscale vapour films governing thermal resistance in amorphous ice. [PDF]

Commun Chem
Liu Y, Eklund T, Karina A, Hövelmann S, Bauer RPC, You S, Goy C, Striker NN, Gierke A, Hess K, Schlage K, Bocklage L, Ardana Lamas F, Wang H, Jiang Y, Uemara Y, Milne C, Kim KH, Murphy B, Lehmkühler F, Zalden P, Amann-Winkel K.   +21 more
europepmc   +1 more source

RRAM-Based Neuromorphic Devices for Artificial-Intelligence Hardware: Device Physics, Materials, Processing, and Packaging. [PDF]

Micromachines (Basel)
Pyo SG.
europepmc   +1 more source

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Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

Materials Science Forum, 2020
Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mohammad Khairul Azhar Abdul Razab, Ir Dr. Mohamad Shaiful Ashrul Ishak, Mazlan Mohamed   +2 more
exaly   +2 more sources

Performance of Thermal Interface Materials

Small, 2022
AbstractThe thermal interface materials (TIMs) used for improving thermal contacts are considered in terms of the performance, performance consideration criteria, performance evaluation methods, and material development approaches. The performance is described mainly by the thermal contact conductance, which refers to the conductance across the thermal
openaire   +2 more sources

Thermal Interface Materials

2009
Increasing electronic device performance has historically been accompanied by increasing power and increasing on-chip power density both of which present a cooling challenge. Thermal Interface Material (TIM) plays a key role in reducing the package thermal resistance and the thermal resistance between the electronic device and the external cooling ...
Ravi Prasher, Chia-Pin Chiu
openaire   +4 more sources

Thermal Conductivity of Thermal Interface Materials

MRS Proceedings, 2007
AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of ...
Travis Z. Fullem, Eric J. Cotts
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Performance and testing of thermal interface materials

Microelectronics Journal, 2003
Abstract The increasing power and reduced die size of CPUs used in computers increases a need for significantly improved thermal interface materials (TIM). The TIM is used to reduce contact resistance at the CPU–heat sink interface. This work provides a state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials ...
J. P. Gwinn, R. L. Webb
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Electrospinning of thermal interface materials

Advances in Colloid and Interface Science
As electronic systems continue to evolve toward higher integration and power densities, the demand for efficient thermal interface materials (TIMs) grows increasingly urgent. Electrospinning has emerged as a versatile and scalable approach for fabricating TIMs with tunable nanofiber architectures and tailored interfacial properties.
Xiachen, Xiao, Baoshan, Xie, Liangxuan, Ouyang, Juefei, Yang, Chengshuai, Li, Jing, Zhao, Youfu, Lv, Xiaoliang, Zeng, Chuanchang, Li   +8 more
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Characterization of Thermal Interface Materials

2006 1st Electronic Systemintegration Technology Conference, 2006
In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data.
Ralph Schacht, Daniel May, Bernhard Wunderle, Olaf Wittler, Astrid Gollhardt, Bernd Michel, Herbert Reichl   +6 more
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Electrical and Thermal Interface Materials

Pan Pacific Symposium, 2008
ABSTRACT Solder is the mainstay of electronics assembly, but many connections need to be made with other materials. This paper addresses the performance of the latest generation of two of these: thermally and electrically conductive materials.
Rob Emery, Tanawan Chaowasakoo
openaire   +1 more source