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An Analytical Modeling Study on the Thermal Behavior of Copper-Carbon Nanotube Composite Through-Silicon Via (TSV). [PDF]

Nanomaterials (Basel)
Ying K, Liang J.
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Electrochemical initiation and chemical reaction cascades in dual-stage thermal runaway in sulfide-based all-solid-state batteries. [PDF]

Nat Commun
Wu Y, Zhang S, Sun Y, Huang L, Xu J, Liu C, Zhu S, Jiang Z, Gong T, Guo L, Cui L, Liu T, Ju J, Cui G.   +13 more
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Performance of Thermal Interface Materials

Small, 2022
AbstractThe thermal interface materials (TIMs) used for improving thermal contacts are considered in terms of the performance, performance consideration criteria, performance evaluation methods, and material development approaches. The performance is described mainly by the thermal contact conductance, which refers to the conductance across the thermal
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Engineered thermal interface material

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn-in systems, LED devices, etc. present challenges in cooling. Many types of consumer devices and sensors are proliferating. All these applications require an ongoing improvement in thermal management.
Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois   +10 more
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Advanced Thermal Interface Materials

MRS Proceedings, 2006
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs.
Yimin Zhang, Allison Xiao, Jeff McVey
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Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

Materials Science Forum, 2020
Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not ...
Mazlan Mohamed, Mohd Nazri Omar, Mohamad Shaiful Ashrul Ishak, Rozyanty Rahman, Yahaya Nor Zaiazmin, Mohammad Khairul Azhar Abdul Razab, Mohd Zharif Ahmad Thirmizir   +6 more
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Thermal Conductivity of Thermal Interface Materials

MRS Proceedings, 2007
AbstractWhile detailed theories exist for thermal conduction due to electrons and phonons in crystalline solids, phonon scattering and transmission at solid/solid interfaces is not as well understood. Steady increases in the power density of microelectronic devices have resulted in an increasing need in the electronics industry for an understanding of ...
Travis Z. Fullem, Eric J. Cotts
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Thermal Characterizations of Solid Thermal Interface Materials

2008 10th Electronics Packaging Technology Conference, 2008
Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materials, including indium, graphite, and fiberglass were conducted. A TIM tester was utilized to measure the
Hengyun Zhang, Y.C. Mui, Poh-Eng Tan, Soon-Hwa Ng   +3 more
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