Results 241 to 250 of about 133,007 (263)

A Survey of Thermal Interface Materials

2023
Yibin Zhang, Gregory O'Bryan
openaire   +1 more source

Reliability for Thermal Interface Materials

Thermal interface materials (TIMs) are critical components in electronic packaging. Thermal greases are paste-like materials with high conductivity filler particles added to a polymer matrix to yield a high conductivity spreadable material. Throughout the operation of the electronic device, thermomechanical stresses lead to failure of thermal greases ...
openaire   +1 more source

Thermal Interface Materials

Electric and Hybrid Vehicle Technology International, 2019
openaire   +2 more sources

Thermal Interface Materials in Electronic Packaging

2010
With the continual increase in cooling demand for electronic packaging, there has been an increased focus within the microelectronics industry on developing high performance thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution.
openaire   +1 more source

Optimization design method of material stiffness of contact interface considering surface roughness for improving thermal contact performance

International Communications in Heat and Mass Transfer, 2023
Qiyin Lin, Jun Hong
exaly  

Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material

Chemical Engineering Journal, 2020
Baotan Zhang, Xiaoliang Zeng, Rong Sun   +2 more
exaly  

Wettability and thermal contact resistance of thermal interface material composited by gallium-based liquid metal on copper foam

International Journal of Heat and Mass Transfer, 2022
Zongyu Wang, Yulong Ji
exaly  

A study on thermal resistance evaluation of carbon nanotube buckypaper with cellulose material for thermal interface material

Diamond and Related Materials, 2022
Seunghyeon Lee, Ajeong Lee, Seungyeop Baek   +2 more
exaly  

Excellent thermal performance of gallium-based liquid metal alloy as thermal interface material between aluminum substrates

Applied Thermal Engineering, 2020
Yulong Ji, Huilong Yan, Xiu Xiao
exaly  

The development of thermal interface materials

Nature Electronics
Zhengli Dou, Chuxin Lei, Kai Wu, Guihua Yu   +3 more
openaire   +1 more source