Results 251 to 260 of about 8,274,419 (297)

Advanced Thermal Interface Materials

MRS Proceedings, 2006
ABSTRACTThermal interface materials (TIMs) are used to dissipate thermal energy from a heat-generating device to a heat sink via conduction. The growing power density of the electronic device demands next-generation high thermal conductivity and/or low thermal resistance TIMs.
Yimin Zhang, Allison Xiao, Jeff McVey
openaire   +1 more source

Engineered thermal interface material

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014
The power dissipation and device junction temperature control in high end processors, stacked and hybrid packages, test and burn-in systems, LED devices, etc. present challenges in cooling. Many types of consumer devices and sensors are proliferating. All these applications require an ongoing improvement in thermal management.
Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois   +10 more
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Superior thermal interface materials for thermal management

Composites Communications, 2019
Abstract Thermal interface materials (TIMs) have been widely used in various electronic devices and are crucial for next generation electronics such as flexible electronics. Ultrathin full carbon films with extraordinary high thermal conductivity (k) and promising mechanical strength have been well documented, but the brittleness (elongation at break~
Chang Ping Feng, Lu Bai, Rui-Ying Bao, Shi-Wei Wang, Zhengying Liu, Ming-Bo Yang, Jun Chen, Wei Yang   +7 more
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Thermal Characterizations of Solid Thermal Interface Materials

2008 10th Electronics Packaging Technology Conference, 2008
Solid thermal interface materials are often used in thermal reliability tests of IC packages to minimize contact thermal resistance without contaminating the test environment. In this paper, thermal characterizations of solid thermal interface materials, including indium, graphite, and fiberglass were conducted. A TIM tester was utilized to measure the
Hengyun Zhang, Y.C. Mui, Poh-Eng Tan, Soon-Hwa Ng   +3 more
openaire   +1 more source

Thermal characterization of thermal interface material bondlines

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2008
Minimizing the thermal resistance of thermal interface material (TIM) bondlines is of interest to the electronics industry. The thermal interface material class examined in this study comprises epoxy based adhesives in which conductive filler particles are suspended.
T. Z. Fullem, D. F. Rae, A. Sharma, J. A. Wolcott, E. J. Cotts   +4 more
openaire   +1 more source

Thermal Interface Materials Testing

SMTA International, 2009
ABSTRACT There exists a need to efficiently remove heat from power electronics within power systems to enhance performance. Thermal management is a critical function to that operation. Reducing the junction temperature of semiconductor power electronic devices enables them to operate at higher currents. Lowering operating temperatures
openaire   +1 more source

Joint Thermal Resistance and Thermal Interface Materials

2023
Heat conduction across a joint of two solids occurs practically in every heat generated system. A significant temperature gradient occurs as heat is transferred by conduction across the joint of two solids. This is due to the thermal contact resistance generated by the surface irregularities.
openaire   +1 more source

Characterization of nanostructured thermal interface materials – A review

International Journal of Thermal Sciences, 2011
Abstract Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance ...
Andrew J. McNamara, Yogendra K. Joshi, Zhuomin M. Zhang   +2 more
openaire   +1 more source

Simultaneous thermal/flow characterization of thermal interface materials

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016
Thermal interface materials used for dissipation of heat in electronic assemblies are often exposed to working conditions that may change the mechanical as well as thermal behavior over time due to both intrinsic change as well as environmental influence [1]. Currently, among thermal interface material solutions, particle filled greases are common. For
Y. Singh, N. Bajaj, G. Subbarayan
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A Survey of Thermal Interface Materials

2023
Yibin Zhang, Gregory O'Bryan
openaire   +1 more source