Results 261 to 270 of about 648,950 (298)

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

ACS Nano, 2019
Along with the technology evolution for dense integration of high-power, high-frequency devices in electronics, the accompanying interfacial heat transfer problem leads to urgent demands for advanced thermal interface materials (TIMs) with both high through-plane thermal conductivity and good compressibility.
Wen Dai, Tengfei Ma, Qingwei Yan, Jingyao Gao, Xue Tan, Le Lv, Hao Hou, Qiuping Wei, Jinhong Yu, Jianbo Wu, Yagang Yao, Shiyu Du, Rong Sun, Nan Jiang, Yan Wang, Jing Kong, Chingping Wong, Shigeo Maruyama, Cheng-Te Lin   +18 more
openaire   +2 more sources

Thermal contact resistance of cured gel polymeric thermal interface material

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004
This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIM's) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIM's is also introduced in this paper.
R.S. Prasher, J.C. Matayabas
openaire   +1 more source

Self–healing Thermal Interface Materials

2020
Thermal interface materials (TIMs) are widely used as gap–filler materials between electronic devices such as LEDs and ICs and their heat sink and aim to control the heat dissipation and to provide mechanical anchoring. As the rated power densities of electronic devices are increasing rapidly, the TIMS are exposed to higher thermal and mechanical loads.
openaire   +3 more sources

Low melting point thermal interface material

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2003
A high performance thermal interface material has been developed that consists of a 25 /spl mu/m coating of low-melting-temperature alloy (LMTA) tinned on each side of a 50 /spl mu/m copper substrate. The alloy has a melting point below the maximum CPU operating temperature. Steady-state tests per ASTM D-5470 show 0.058 K-cm/sup 2//W at 138 kPa contact
R.L. Webb, J.P. Gwinn
openaire   +1 more source

Thermal interface tailoring in composite materials

Diamond and Related Materials, 2010
The thermal transport in heterogeneous materials systems, such as in composites, is essentially controlled by the phonon scattering phenomena at the materials interface due to the interface materials property mismatch. Such phenomena are also prevalent in joints or component interfaces.
A.K. Roy, B.L. Farmer, S. Sihn, V. Varshney, S. Patnaik, S. Ganguli   +5 more
openaire   +1 more source

Recent progress of thermal interface materials

2008 2nd Electronics Systemintegration Technology Conference, 2008
This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced.
J. Liu, null Teng Wang, B. Carlberg, M. Inoue   +3 more
openaire   +1 more source

Challenges in thermal interface material testing

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006
Characterization of thermal properties of thermal interface materials (TIMs) has gained increasing importance as the relative percentage of overall semiconductor package material thermal resistance attributable to the TIMs has increased. The development of new TIM materials has increasingly focused on materials with very high performance and, in ...
Clemens J.M. Lasance, Cameron T. Murray, David L. Saums, Marta Rencz   +3 more
openaire   +1 more source

Characterization of nanostructured thermal interface materials – A review

International Journal of Thermal Sciences, 2011
Abstract Due to high heat dissipation rates in current and projected future semiconductor devices, much attention has been given to improving paths of heat transport within the device package. A key focus is on improved thermal interface materials (TIMs), used in joining surfaces in a microelectronic package to reduce interface thermal resistance ...
Andrew J. McNamara, Yogendra K. Joshi, Zhuomin M. Zhang   +2 more
openaire   +1 more source

Thermal Interface Material Resistance Measurement Apparatus

2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface, 2006
It is well known that as the size of microprocessors decreases with respect to Moore's law, cooling issues have become more predominant and critical for the electronics industry. One source of thermal resistance requiring more characterization is Thermal Interface Materials, TIMs.
S.S. Badoni, null Jinny Rhee
openaire   +1 more source

2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

Advanced Materials
AbstractThe challenges associated with heat dissipation in high‐power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high‐performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks.
Wen Dai, Yandong Wang, Maohua Li, Lu Chen, Qingwei Yan, Jinhong Yu, Nan Jiang, Cheng‐Te Lin   +7 more
openaire   +2 more sources