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Experimental investigation of high temperature thermal contact resistance with interface material
Theoretical and Applied Mechanics Letters, 2011Donghuan Liu, Xinchun Shang
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Multiscale Evaluation of Thermal Conductance of Thermal Interface Materials
2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Jaehyung Song +6 more
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