Results 31 to 40 of about 5,766 (227)
Investigation of the Undercoolability of Ni-Based Alloys Using High Temperature Thermal Analysis
During the single crystal (SX) solidification of turbine blades, grain defects can form in the platform regions which have abruptly varying cross-sections.
Samuel Bogner +5 more
doaj +1 more source
The selection of Saffman-Taylor fingers by kinetic undercooling [PDF]
The selection of Saffman-Taylor fingers by surface tension has been widely studied. Here their selection is analysed by another regularisation widely adopted in studying otherwise ill-posed Stefan problems, namely kinetic undercooling.
Chapman, Stephen +4 more
core +1 more source
Microstructure evolution in undercooled Ag-50at. %Cu hypereutectic alloy
Ag–Cu alloys, as one type of typical eutectic solders, have been widely used in microelectronic packaging. The welding performance of Ag–Cu solders is closely associated with their microstructures.
Shunmeng Zhang +8 more
doaj +1 more source
(Uploaded by Plazi from the Biodiversity Heritage Library) No abstract provided.
openaire +2 more sources
An Interesting Case of Undercooling [PDF]
Whenever the subject of undercooling of a liquid is taken up in a physics text, some such statements as those quoted appear in the discussion. The difficulties of getting a successful mass demonstration of the undercooling of water are well known.
McCracken, Earl C.
core +1 more source
Soft Modes in Undercooled Liquids [PDF]
Abstract Recent studies of soft vibrational, tunneling and relaxational modes in glasses support the validity of the soft potential model, an extension of the tunneling model. The implications of this validity are investigated for the undercooled liquid.
openaire +1 more source
A system of steady lamellar eutectic growth in directional solidification is considered with the case of small tangent values of the contact angles. The mathematical model is given in the non-dimensional rectangular coordinate system and the uniformly ...
Jing Xiao, Xiangming Li
doaj +1 more source
DSC investigation of the undercooling of SnAgCu solder alloys
S.53-57This study investigates the undercooling of commercially available SnAgCu solder alloys by Differential Scanning Calorimetry (DSC - rate 10 K/min).
Mueller, M., Türke, A., Panchenko, I.
core +1 more source
Deep‐UV (258 nm) femtosecond pulses enable uniform amorphous silicon writing on Si(100)/(111) with a six‐fold larger fluence amorphization window than NIR methods. Optimized fluence and overlap yield 20–45 nm uniform and continuous amorphous layers. Microscopy shows sharp interfaces, and real‐time reflectivity reveals nanosecond melt–resolidification ...
Wissal Benali +5 more
wiley +1 more source
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints [PDF]
Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of electronic joints. Various combinations
Rudajevová, A., Dušek, K.
core

