Results 261 to 270 of about 130,994 (305)
Some of the next articles are maybe not open access.
Wafer Bonding for MEMS Vacuum Packaging
ECS Transactions, 2014Various Micro- Electro- Mechanical Systems (MEMS) devices are incorporated into mobile electronic devices. A particular category of MEMS devices require vacuum packaging by wafer bonding with the requirement to encapsulate vacuum levels of 10-3 mbar or higher with long time stability.
Viorel Dragoi, Eric Pabo
openaire +1 more source
Modified atmospheres and vacuum packaging
2003The ability of modified-atmosphere packaging (MAP) to extend the shelf-life of foods has been known for a long time. First, the delaying effects of MAP or controlled-atmosphere storage (CAP) on the ripening of fruits and vegetables were discovered. In the 1920s, studies at the Low Temperature Research Station in Cambridge, UK, demonstrated that the ...
openaire +1 more source
The UNICOS-CPC Vacuum Controls Package
2018Proceedings of the 16th Int. Conf.
Blanchard, Sebastien +10 more
openaire +1 more source
Degradation mechanisms of perovskite solar cells under vacuum and one atmosphere of nitrogen
Nature Energy, 2021Renjun Guo, Dan Han, Wei Chen
exaly
Manipulating matter by strong coupling to vacuum fields
Science, 2021Francisco Garcia-Vidal +2 more
exaly
A vacuum-deposited polymer dielectric for wafer-scale stretchable electronics
Nature Electronics, 2023Ja Hoon Koo, , Junhwan Choi
exaly
Vacuum Metallizing for Flexible Packaging
2010Charles A. Bishop, Eldridge M. Mount
openaire +1 more source