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Reliability of vacuum packaged MEMS gyroscopes
Microelectronics Reliability, 2005The greatest challenge for the successful commercialization of MEMS (micro-electro-mechanical system) technology is proving its reliability. Of concern in particular are the reliability and long-term stability of wafer level vacuum packaged MEMS gyroscope sensors subjected to cyclic mechanical stresses at high frequencies. In this study, we carried out
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Wafer Bonding for MEMS Vacuum Packaging
ECS Transactions, 2014Various Micro- Electro- Mechanical Systems (MEMS) devices are incorporated into mobile electronic devices. A particular category of MEMS devices require vacuum packaging by wafer bonding with the requirement to encapsulate vacuum levels of 10-3 mbar or higher with long time stability.
Viorel Dragoi, Eric Pabo
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Modified atmospheres and vacuum packaging
2003The ability of modified-atmosphere packaging (MAP) to extend the shelf-life of foods has been known for a long time. First, the delaying effects of MAP or controlled-atmosphere storage (CAP) on the ripening of fruits and vegetables were discovered. In the 1920s, studies at the Low Temperature Research Station in Cambridge, UK, demonstrated that the ...
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The UNICOS-CPC Vacuum Controls Package
2018Proceedings of the 16th Int. Conf.
Blanchard, Sebastien +10 more
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Degradation mechanisms of perovskite solar cells under vacuum and one atmosphere of nitrogen
Nature Energy, 2021Renjun Guo, Dan Han, Wei Chen
exaly
Vacuum Metallizing for Flexible Packaging
2010Charles A. Bishop, Eldridge M. Mount
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