Results 1 to 10 of about 23 (21)

Crioablação da Região Para-Hissiana

Journal of Cardiac Arrhythmias, 2019
Fundamentos: A ablação da região para-Hissiana é um desafi o devido ao risco de lesão inadvertida do feixe de His. A crioablação, pela sua progressão mais lenta, permite a interrupção da aplicação em caso de sinais de lesões indesejadas e adesividade do
Leonardo Rezende de Siqueira, Nilson Araujo de Oliveira Junior, Olga Ferreira de Souza, Rodrigo Periquito Cosenza, Martha Valéria Tavares Pinheiro, Angelina Camiletti   +5 more
doaj   +4 more sources

Position Statement on the Use of Myocardial Strain in Cardiology Routines by the Brazilian Society of Cardiology's Department Of Cardiovascular Imaging - 2023. [PDF]

Arq Bras Cardiol, 2023
Almeida ALC, Melo MDT, Bihan DCSL, Vieira MLC, Pena JLB, Del Castillo JM, Abensur H, Hortegal RA, Otto MEB, Piveta RB, Dantas MR, Assef JE, Beck ALS, Santo THCE, Silva TO, Salemi VMC, Rocon C, Lima MSM, Barberato SH, Rodrigues AC, Rabschkowisky A, Frota DDCR, Gripp EA, Barretto RBM, Silva SME, Cauduro SA, Pinheiro AC, Araujo SP, Tressino CG, Silva CES, Monaco CG, Paiva MG, Fisher CH, Alves MSL, Grau CRPC, Santos MVCD, Guimarães ICB, Morhy SS, Leal GN, Soares AM, Cruz CBBV, Guimarães Filho FV, Assunção BMBL, Fernandes RM, Saraiva RM, Tsutsui JM, Soares FLJ, Falcão SNDRS, Hotta VT, Armstrong ADC, Hygidio DA, Miglioranza MH, Camarozano AC, Lopes MMU, Cerci RJ, Siqueira MEM, Torreão JA, Rochitte CE, Felix A.   +58 more
europepmc   +1 more source

Characterization of through-silicon vias using laser terahertz emission microscopy

Nature Electronics, 2021
Kristof J P Jacobs, Hironaru Murakami, Fumikazu Murakami   +2 more
exaly  

Solid-state qubits integrated with superconducting through-silicon vias

Npj Quantum Information, 2020
Donna-Ruth Yost, Mollie E Schwartz, Greg Calusine   +2 more
exaly  

Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

Applied Surface Science, 2022
Dileep Kumar Mishra, Pradeep Dixit
exaly  

Bending reliability of screen-printed vias for a flexible energy module

Npj Flexible Electronics, 2020
Manu Kujala, Terho Kololuoma, Jari A Keskinen   +2 more
exaly  

Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

IEEE Transactions on Electron Devices, 2010
Chuan Xu, Kaustav Banerjee
exaly  

Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

Scientific Reports, 2017
Junjie Yu, Wei Chu, Ya Cheng
exaly  

Broadband Monopolar Microstrip Patch Antenna With Shorting Vias and Coupled Ring

IEEE Antennas and Wireless Propagation Letters, 2014
Juhua Liu, Shao Y Zheng, Yuanxin li
exaly  

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Applied Physics Letters, 2012
Jay Im, Rui Huang
exaly