Results 1 to 10 of about 24 (22)

Crioablação da Região Para-Hissiana

Journal of Cardiac Arrhythmias, 2019
Fundamentos: A ablação da região para-Hissiana é um desafi o devido ao risco de lesão inadvertida do feixe de His. A crioablação, pela sua progressão mais lenta, permite a interrupção da aplicação em caso de sinais de lesões indesejadas e adesividade do
Leonardo Rezende de Siqueira, Nilson Araujo de Oliveira Junior, Olga Ferreira de Souza, Rodrigo Periquito Cosenza, Martha Valéria Tavares Pinheiro, Angelina Camiletti   +5 more
doaj   +4 more sources

Position Statement on the Use of Myocardial Strain in Cardiology Routines by the Brazilian Society of Cardiology's Department Of Cardiovascular Imaging - 2023. [PDF]

Arq Bras Cardiol, 2023
Almeida ALC, Melo MDT, Bihan DCSL, Vieira MLC, Pena JLB, Del Castillo JM, Abensur H, Hortegal RA, Otto MEB, Piveta RB, Dantas MR, Assef JE, Beck ALS, Santo THCE, Silva TO, Salemi VMC, Rocon C, Lima MSM, Barberato SH, Rodrigues AC, Rabschkowisky A, Frota DDCR, Gripp EA, Barretto RBM, Silva SME, Cauduro SA, Pinheiro AC, Araujo SP, Tressino CG, Silva CES, Monaco CG, Paiva MG, Fisher CH, Alves MSL, Grau CRPC, Santos MVCD, Guimarães ICB, Morhy SS, Leal GN, Soares AM, Cruz CBBV, Guimarães Filho FV, Assunção BMBL, Fernandes RM, Saraiva RM, Tsutsui JM, Soares FLJ, Falcão SNDRS, Hotta VT, Armstrong ADC, Hygidio DA, Miglioranza MH, Camarozano AC, Lopes MMU, Cerci RJ, Siqueira MEM, Torreão JA, Rochitte CE, Felix A.   +58 more
europepmc   +1 more source

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Micromachines, 2022
Daquan Yu, Zuohuan Chen, Yu Daquan
exaly  

Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management

Micromachines, 2023
Bing Dai, Jiaqi Zhu, Jiwen Zhao
exaly  

Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects

Micromachines, 2022
Hu Chuan
exaly  

Wetting process of copper filling in through silicon vias

Applied Surface Science, 2015
Liming Gao
exaly  

Stress measurements in tungsten coated through silicon vias for 3D integration

Thin Solid Films, 2013
Stephanie Escoubas, F Schrank
exaly  

Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations

Microwave and Optical Technology Letters, 2001
Leung Tsang
exaly  

Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor

Micromachines, 2018
Xiao Tan, Tiantong Xu
exaly  

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Microelectronic Engineering, 2010
Zheyao Wang, Jian Cai
exaly