Results 1 to 10 of about 62,118 (59)

Crioablação da Região Para-Hissiana

Journal of Cardiac Arrhythmias, 2019
Fundamentos: A ablação da região para-Hissiana é um desafi o devido ao risco de lesão inadvertida do feixe de His. A crioablação, pela sua progressão mais lenta, permite a interrupção da aplicação em caso de sinais de lesões indesejadas e adesividade do
Leonardo Rezende de Siqueira, Nilson Araujo de Oliveira Junior, Olga Ferreira de Souza, Rodrigo Periquito Cosenza, Martha Valéria Tavares Pinheiro, Angelina Camiletti   +5 more
doaj   +4 more sources

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Micromachines, 2022
Daquan Yu, Zuohuan Chen
exaly  

Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management

Micromachines, 2023
Bing Dai, Jiaqi Zhu, Jiwen Zhao
exaly  

Wetting process of copper filling in through silicon vias

Applied Surface Science, 2015
Liming Gao
exaly  

Stress measurements in tungsten coated through silicon vias for 3D integration

Thin Solid Films, 2013
Stephanie Escoubas
exaly  

Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations

Microwave and Optical Technology Letters, 2001
Leung Tsang
exaly  

Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor

Micromachines, 2018
Xiao Tan, Tiantong Xu
exaly  

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Microelectronic Engineering, 2010
Zheyao Wang, Jian Cai, Qianwen Chen
exaly  

Crosstalk Analysis for Different Types of PCB VIAS Models at High-Frequency Transmission

SpringerBriefs in Applied Sciences and Technology, 2023
exaly  

High aspect ratio copper through-silicon-vias for 3D integration

Microelectronic Engineering, 2008
Zheyao Wang, Jian Cai, Qianwen Chen
exaly