Results 91 to 95 of about 6,621 (95)

Higher‐mode textile patch antenna with embroidered vias for on‐body communication

IET Microwaves, Antennas and Propagation, 2016
William G Whittow, Antonis A Alexandridis   +1 more
exaly  

Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets

Nature Electronics
Dong Hae Ho, Ling Li, Michael D Bartlett
exaly  

Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014
exaly  

Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias

Jom, 2011
exaly  

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

IBM Journal of Research and Development, 2008
exaly