Results 81 to 90 of about 6,621 (95)

Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

Scientific Reports, 2017
Junjie Yu, Wei Chu, Ya Cheng
exaly  

Síndrome de Wolff-Parkinson-White e outras Vias Acessórias Atrioventriculares em 1465 Pacientes Submetidos à Ablação por Radiofreqüência Wolff-Parkinson-White Syndrome and other Atrioventricular Accessory Pathways in 1,465 Patients Undergoing Radio-Frequency Ablation

, 2008
Iara Atié, Washington Maciel, Eduardo Machado Andréa, Nilson Araújo, Hécio Carvalho, Luís Gustavo Belo, Leonardo Siqueira, Cláudio Munhoz, Rodrigo Periquito Cosenza, Fabiana Mitidieri, Lara Fonseca, Cristiane Bortoluzzo, Tarik Arcoverde, Bruno Rustum Andréa, Jacob Atié   +14 more
openalex  

Broadband Monopolar Microstrip Patch Antenna With Shorting Vias and Coupled Ring

IEEE Antennas and Wireless Propagation Letters, 2014
Juhua Liu, Shao Y Zheng, Yuanxin li
exaly  

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

Applied Physics Letters, 2012
Jay Im, Rui Huang
exaly  

Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias

Journal of the Electrochemical Society, 2013
Thomas Moffat, Daniel Josell
exaly  

Fully Inkjet Printed RF Inductors and Capacitors Using Polymer Dielectric and Silver Conductive Ink With Through Vias

IEEE Transactions on Electron Devices, 2015
Garret McKerricher, Atif Shamim
exaly  

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias

Microelectronics Reliability, 2013
Tengfei Jiang, Qiu Zhao, Jay Im
exaly  

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Electrochimica Acta, 2013
Fumihiro Inoue, Harold Philipsen, Silvia Armini   +2 more
exaly  

Design of Periodic Shorting-Vias for Suppressing the Fundamental Mode in Microstrip Leaky-Wave Antennas

IEEE Transactions on Antennas and Propagation, 2015
Juhua Liu, Yuanxin li
exaly  

Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing

Journal of Electronic Materials, 2012
Byoung-Joon Kim, Nobumichi Tamura, Martin Kunz   +2 more
exaly