Results 151 to 156 of about 341 (156)

Simulation and Experimental Study of the Warpage of Fan-Out Wafer-Level Packaging: The Effect of the Manufacturing Process and Optimal Design

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019
Mei-Ling Wu, Jia-Shen Lan
exaly  

Numerical Analysis of Warpage and Reliability of Fan-out Wafer Level Package

Journal of the Microelectronics and Packaging Society, 2014
Sung-Hoon Choa
exaly  

Review of factors affecting warpage of silicon wafers

Microelectronics Reliability, 1981
openaire   +1 more source

The Impact of Wafer Warpage-Induced Unevenness on Alignment

2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
Pan Liu, Tianhao Huang, Zeyang Chen, Chenhang Ma, Jianming Wu, Dawei Gao, Guodong Zhou   +6 more
openaire   +1 more source

SOI by Silicon Wafer Direct Bonding - Problems of Wafer Warpage and Surface Chemistry

Solid State Phenomena, 1991
G. Kissinger, W. Kissinger, H. Hofmann, Joachim Krüger   +3 more
openaire   +1 more source

Wafer Warpage Simulation and Correction for 3D Packaging

2024 25th International Conference on Electronic Packaging Technology (ICEPT)
Xinpeng Chen, Baoxia Li
openaire   +1 more source