Results 141 to 150 of about 341 (156)

Finite element modeling and analysis method for predicting and optimizing the warpage of construction before flip chip bonding in System-on-Wafer process flow

Microelectronics Reliability, 2023
Guandong Liu
exaly  

Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020
Hsien-Chie Cheng
exaly  

Representative volume element analysis for wafer-level warpage using Finite Element methods

Materials Science in Semiconductor Processing, 2019
Woo Seok Yang, Seong Jin Park
exaly  

Study of Dicing Street Effect for Warpage Reduction in Wafer-to-Wafer Bonding Fabrication

Extended Abstracts of the 2021 International Conference on Solid State Devices and Materials, 2021
Wei Feng, Haruo Shimamoto, Tsuyoshi Kawagoe, Ichirou Honma, Masato Yamasaki, Fumitake Okutsu, Takatoshi Masuda, Katsuya Kikuchi   +7 more
openaire   +1 more source

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Journal of Electronic Packaging, Transactions of the ASME, 2020
Hsien-Chie Cheng
exaly  

A novel mechanical diced trench structure for warpage reduction in wafer level packaging process

Microelectronics Reliability, 2015
Chunsheng Zhu, Gaowei Xu
exaly  

Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012
F X Che, Xiaowu Zhang
exaly  

Mechanism and Control Technique of Wafer Warpage in Process Integration for Trench Field Plate Power MOSFET

IEEE Transactions on Semiconductor Manufacturing, 2019
Hiroaki Kato, Kenya Kobayashi
exaly  

Warpage Simulation by the CTE mismatch in Blanket Structured Wafer Level 3D packaging

Journal of the Korean Society of Manufacturing Technology Engineers, 2013
Seong Keol Kim
exaly  

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017
John H Lau, Ming Li, Nelson Fan
exaly