Results 131 to 140 of about 341 (156)

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023
Serena Iacovo, Koen D'havé, Oguzhan Orkut Okudur, Joeri De Vos, Thomas Uhrmann, Thomas Plach, Thierry Conard, Johan Meersschaut, Pieter Bex, Steven Brems, Alain Phommahaxay, Mario Gonzalez, Liesbeth Witters, Gerald Beyer, Eric Beyne   +14 more
openaire   +1 more source

Influence of oxygen precipitates on the warpage of annealed silicon wafers

Microelectronic Engineering, 2003
The warpage of conventional Czochralski (CZ) and nitrogen-doped Czochralski silicon (NCZ) wafers with similar oxygen concentration were investigated. In the experiments, a two-step annealing process was taken to generate oxygen precipitates. After the elevated temperature annealing, no obvious warpage in both the CZ and NCZ silicon wafers was found ...
Deren Yang, Gan Wang, Jin Xu, Dongsheng Li, Duanlin Que, C. Funke, H.J. Moeller   +6 more
openaire   +1 more source

Effect of Passivation Layer on Wafer Warpage

Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials, 2023
Wei Feng, Haruo Shimamoto, Katsuya Kikuchi   +2 more
openaire   +1 more source

An Optical Imaging Method for Wafer Warpage Measurements

Journal of The Electrochemical Society, 1985
Mise au point d'une methode simple pour evaluer rapidement le gauchissement et la qualite de la surface de pastilles obtenues par la technologie MOS. Comparaison avec les methodes d'interference optique et de transmission RX.
openaire   +1 more source

Warpage and Stress Study of Wafer-to-Wafer Bonding Fabrication Process

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials, 2022
Wei FENG, Haruo Shimamoto, Tsuyoshi Kawagoe, Ichirou Honma, Masato Yamasaki, Fumitake Okutsu, Takatoshi Masuda, Katsuya Kikuchi   +7 more
openaire   +1 more source

BOW AND WARPAGE OF SILICON WAFERS

Extended Abstracts of the 1980 International Conference on Solid State Devices and Materials, 1980
Shin. Takasu, H. Otsuka, N. Yoshihiro, T. Oku, M. Ishida   +4 more
openaire   +1 more source

Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process

Materials, 2022
Chuan Chen, Yunyan Zhou, Liqiang Cao
exaly  

Thermal Wafer Warpage and its Avoidance

Solid State Phenomena, 1991
A. Fischer, Hans Richter
openaire   +1 more source

Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication

IEEE Transactions on Electron Devices, 2022
Wei Feng, Haruo Shimamoto, Katsuya Kikuchi   +2 more
exaly  

Isolation Process Induced Wafer Warpage

Electrochemical and Solid-State Letters, 1999
openaire   +1 more source