Application of Cooling Layer and Thin Thickness Between Coolant and Cavity for Mold Temperature Control and Improving Filling Ability of Thin-Wall Injection Molding Product. [PDF]
Polymers (Basel)Uyen TMT, Minh PS, Thanh BC.
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Multi-Objective Optimization of Injection Molding Process Parameters for Junction Boxes Based on BP Neural Network and NSGA-II Algorithm. [PDF]
Materials (Basel)Hong T +5 more
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A Review on Injection Molding: Conformal Cooling Channels, Modelling, Surrogate Models and Multi-Objective Optimization. [PDF]
Polymers (Basel)Gaspar-Cunha A +3 more
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Optimization of Injection Molding Processing Parameters for Thin-Walled Plastic Parts Manufactured for the Automotive Industry. [PDF]
Polymers (Basel)Potuk NO +4 more
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Simulation Analysis of Temperature Change in FDM Process Based on ANSYS APDL and Birth-Death Element Technology. [PDF]
Micromachines (Basel)Mi Y, Hashemi Sohi SH.
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Numerical Investigation of Crack Suppression Strategies in Ultra-Thin Glass Substrates for Advanced Packaging. [PDF]
Micromachines (Basel)Le XB, Yoo KY, Choa SH.
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Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]
Materials (Basel)Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
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Fabrication of Polyimide/Aluminum Nitride Composites and Wafer Channel Filling via Direct Ink Writing. [PDF]
Nanomaterials (Basel)Xiao J +5 more
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Study on Cooling Layer and Thin Insert Thickness Between Coolant and Cavity for Injection Mold with Bridge-Type Composite Product. [PDF]
Polymers (Basel)Uyen TMT, Minh PS, Dang HS, Thanh BC.
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Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs. [PDF]
Sci RepLakkaraju AR +3 more
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