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Effect of Thermal and Vibration Changes on Automated External Defibrillator Circuit Boards: Finite Element Analysis Study. [PDF]
JMIRx MedOlalere SO.
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Journal of Electronic Packaging, 2018 In recent years, due to the increased size of ball grid array (BGA) devices, the assembly of BGAs on printed circuit boards through surface mount technology has encountered unprecedented challenges from thermal warpage. The excessive warpage of BGAs in the reflow process may cause manufacture problems and even the risk of failure. Thus, it is essential
Zhang, Qiming +3 more
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Representative volume element analysis for wafer-level warpage using Finite Element methods
Materials Science in Semiconductor Processing, 2019 Wafer warpage of semiconductors in the manufacturing process is severe problem that decreases the quality and productivity. As the 3D NAND flash was developed, warpage became more important because the stack height increased. Some researches were carried
Woo Seok Yang, Seong Jin Park
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Polymer Engineering & Science, 1996
Abstract A warpage index (Δψ m ) was introduced for studying warpage characteristics of a plastic part injection molded from PA66 compounded with 30 wt% glass fiber. Δψ m
Hiroyuki Kikuchi, Kiyohito Koyama
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Abstract A warpage index (Δψ m ) was introduced for studying warpage characteristics of a plastic part injection molded from PA66 compounded with 30 wt% glass fiber. Δψ m
Hiroyuki Kikuchi, Kiyohito Koyama
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Conference Proceedings. 1997 International Conference on Indium Phosphide and Related Materials, 2002
InP wafer warpage induced during its processing has been investigated. Magnitude and shape of wafer warpage caused by surface damage, which is presumed to give tensile stress to wafer, was influenced by its dopant. After MOCVD growth some wafer warpage changed but only a little and smooth surfaces of epi-layer were achieved.
T. Fukui, H. Kurita, N. Makino
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InP wafer warpage induced during its processing has been investigated. Magnitude and shape of wafer warpage caused by surface damage, which is presumed to give tensile stress to wafer, was influenced by its dopant. After MOCVD growth some wafer warpage changed but only a little and smooth surfaces of epi-layer were achieved.
T. Fukui, H. Kurita, N. Makino
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2011
It is known that the dimension of an injection-molded product, as it cools after the molding process, is usually different from the corresponding dimension of the mold cavity. The geometric reduction in the size of the part is referred to as mold shrinkage, or as-molded shrinkage, or simply shrinkage.
Rong Zheng, Roger. I. Tanner, Xi-Jun Fan
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It is known that the dimension of an injection-molded product, as it cools after the molding process, is usually different from the corresponding dimension of the mold cavity. The geometric reduction in the size of the part is referred to as mold shrinkage, or as-molded shrinkage, or simply shrinkage.
Rong Zheng, Roger. I. Tanner, Xi-Jun Fan
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Frontiers in Optics + Laser Science 2022 (FIO, LS), 2022
Refractive warping happens to photons in the field-of-warpage extending outside of a material's surface. The fields-of-warpage result from the Unification of Special and General Relativity.
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Refractive warping happens to photons in the field-of-warpage extending outside of a material's surface. The fields-of-warpage result from the Unification of Special and General Relativity.
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Journal of The Electrochemical Society, 1980
High temperature processing of Czochralski grown silicon wafers can create temperature gradients high enough to generate slip. The generation of slip and the slip patterns have been found to depend on three factors: the temperature and the temperature gradient, the amount and form of the precipitated oxygen, and the direction of the initial bow and the
B. Leroy, C. Plougonven
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High temperature processing of Czochralski grown silicon wafers can create temperature gradients high enough to generate slip. The generation of slip and the slip patterns have been found to depend on three factors: the temperature and the temperature gradient, the amount and form of the precipitated oxygen, and the direction of the initial bow and the
B. Leroy, C. Plougonven
openaire +1 more source