Results 171 to 180 of about 4,969 (222)
Journal of Thermoplastic Composite MaterialsIn this study, we investigated the effect of several processing conditions on warpage in carbon-fibre/PEKK composites manufactured under non-isothermal conditions.
Rehan Umer
exaly +2 more sources
Some of the next articles are maybe not open access.
Related searches:
Related searches:
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011
With the continued demand for fine features, enhanced assembly yield, and improved reliability in the microelectronic packaging industry, there is a need to reduce substrate warpage. Factors such as coefficient of thermal expansion mismatch among several materials in the packaging substrate, modulus of different materials, thickness of different layers,
Sathyanarayanan Raghavan +6 more
openaire +1 more source
With the continued demand for fine features, enhanced assembly yield, and improved reliability in the microelectronic packaging industry, there is a need to reduce substrate warpage. Factors such as coefficient of thermal expansion mismatch among several materials in the packaging substrate, modulus of different materials, thickness of different layers,
Sathyanarayanan Raghavan +6 more
openaire +1 more source
Numerical analysis of the warpage problem in TSOP
Microelectronics Reliability, 2004Abstract The reliability and the solderability of thin small outline package (TSOP) are significantly affected by the warpage that is generated after epoxy molding compound (EMC) molding process. This warpage problem mainly results from the mismatch of material properties such as Young's modulus, Poisson's ratio and coefficient of thermal expansion ...
Kyoungsoon Cho, Insu Jeon
openaire +1 more source
BGA with Controllable Warpage Used to Confirm the Need For a Lower Warpage Specification
SMTA International, 2017ABSTRACT There have been many publications, industry workshops, and symposia that describe process mitigation techniques for minimizing the occurrence of Head-on-Pillow (HoP) defects during surface mount assembly. This paper addresses the root cause of the HoP defect; specifically, the link between HoP defects and component warpage ...
openaire +1 more source
BGA Warpage and Assembly Challenges
SMTA International, 2004ABSTRACT Raytheon Missile Systems (RMS) continues to use electronic packaging technologies such as Ball Grid Arrays (BGA), Chip Scale Packages (CSP), and Stacked Chip Scale Packages in its system designs. As the demand continues to drive towards higher density packaging along with a corresponding increase in functionality, component ...
Mradul Mehrotra +5 more
openaire +1 more source
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018
Wafer level chip-scale package (WL-CSP) becomes more and more popular in IC packaging industry due to its small form factor and low cost. Redistribution layer (RDL) which is widely used in WL-CSP usually causes serious warpage due to the plastic deformation in the thermal processes, and the Cu layer in RDL contributes 1/3 of the total warpage in 2P1M ...
Gong Cheng, Gaowei Xu, Wei Gai, Le Luo
openaire +1 more source
Wafer level chip-scale package (WL-CSP) becomes more and more popular in IC packaging industry due to its small form factor and low cost. Redistribution layer (RDL) which is widely used in WL-CSP usually causes serious warpage due to the plastic deformation in the thermal processes, and the Cu layer in RDL contributes 1/3 of the total warpage in 2P1M ...
Gong Cheng, Gaowei Xu, Wei Gai, Le Luo
openaire +1 more source
1962
One of the problems that we must face when using wood is that it is constantly changing in shape and volume. How much and at what rate wood will shrink or swell depends on how much moisture the wood contains: freshly sawn wood contains a great deal; lumber that has been seasoned contains little.
openaire +1 more source
One of the problems that we must face when using wood is that it is constantly changing in shape and volume. How much and at what rate wood will shrink or swell depends on how much moisture the wood contains: freshly sawn wood contains a great deal; lumber that has been seasoned contains little.
openaire +1 more source
Warpage modeling for 3D packages
2012 2nd IEEE CPMT Symposium Japan, 2012Package warpage is a primary concern in a package-on-package. To enhance the accuracy of modeling prediction, viscoelastic parameters, the change of material properties after injection mold cure (IMC) and post mold cure (PMC) temperature and it's time, and cure shrinkage were studied with a dynamic modulus analysis (DMA) and a thermal mechanical ...
M. Amagai, Y. Suzuki
openaire +1 more source
Warpage, anisotropy, and part thickness
Polymer Engineering & Science, 1996Abstract Relations among warpage, material anisotropy, and part thickness were numerically investigated for disks injection molded from PA66 compounded with 33 wt% glass fiber. Finite element analysis was used for calculating flow fields in injection, fiber orientation, material anisotropy, and warpage.
Hiroyuki Kikuchi, Kiyohito Koyama
openaire +1 more source
Control of Warpage During Machining
SAE Technical Paper Series, 1971<div class="htmlview paragraph">The increased use of large aluminum-alloy forgings for structural components of the jumbo jet air transport brought attention to bear on the costly distortion problem associated with machining these forgings.</div> <div class="htmlview paragraph">This paper discusses one warpage problem-the floor beam ...
openaire +1 more source