Results 1 to 10 of about 89 (89)
Spin-acoustic control of silicon vacancies in 4H silicon carbide
AbstractBulk acoustic resonators can be fabricated on the same substrate as other components and can operate at various frequencies with high quality factors. Mechanical dynamic metrology of these devices is challenging as the surface information available through laser Doppler vibrometry lacks information about the acoustic energy stored in the bulk ...
Jonathan R. Dietz +4 more
openaire +3 more sources
Impact ionization coefficients of 4H silicon carbide [PDF]
Anisotropy of the impact ionization coefficients of 4H silicon carbide is investigated by means of the avalanche breakdown behavior of p+n diodes on (0001) and (112¯0) 4H silicon carbide epitaxial wafers. The impact ionization coefficients are extracted from the avalanche breakdown voltages and the multiplication of a reverse leakage current, due to ...
T. Hatakeyama +5 more
openaire +1 more source
Chemical–Mechanical Polishing of 4H Silicon Carbide Wafers
Abstract4H silicon carbide (4H‐SiC) holds great promise for high‐power and high‐frequency electronics, in which high‐quality 4H‐SiC wafers with both global and local planarization are cornerstones. Chemical–mechanical polishing (CMP) is the key processing technology in the planarization of 4H‐SiC wafers.
Wantang Wang +6 more
openaire +2 more sources
On the Suitability of 3C-Silicon Carbide as an Alternative to 4H-Silicon Carbide for Power Diodes [PDF]
Major recent developments in growth expertise related to the cubic polytype of Silicon Carbide, the 3C-SiC, coupled with its remarkable physical properties and the low fabrication cost, suggest that within the next years, 3C-SiC devices can become a commercial reality.
Anastasios E. Arvanitopoulos +6 more
openaire +4 more sources
4H Silicon Carbide Etching Using Chlorine Trifluoride Gas [PDF]
The etching technology for 4H-silicon carbide (SiC) was studied using ClF3 gas at 673-973K, 100 % and atmospheric pressure in a horizontal reactor. The etch rate, greater than 10 um/min, can be obtained for both the C-face and Si-face at substrate temperatures higher than 723 K. The etch rate increases with the increasing ClF3 gas flow rate.
Hitoshi Habuka +9 more
openaire +1 more source
Porous single crystalline 4H silicon carbide rugate mirrors [PDF]
Porous 4H silicon carbide optical rugate mirrors have been fabricated with a combination of metal assisted photochemical etching and photoelectrochemical etching. The degree of porosity was controlled by the applied voltage, while the etching depth was controlled by measuring the transferred charge.
Markus Leitgeb +3 more
openaire +2 more sources
A pH‐responsive biomaterial interface integrates bactericidal peptides, cell‐recruiting peptides, and magnesium ions into a multifunctional system. Infection‐induced acidification triggers antimicrobial peptide release while cell‐recruiting peptides mobilize bone marrow stem cells.
Zhenyu Li +9 more
wiley +1 more source
A functionally driven variable‐cell size and gradient‐conductive coated TPMS structure was developed. Accordingly, stepwise longitudinal gradient impedance was realized, achieving absorption‐dominant EMI shielding (absorptivity≈0.85) with an EMI SET of ≈ 59 dB, for 10 mm‐thick composites. Further increasing the thickness of composites to 20 mm achieved
Abdallah Kamal +7 more
wiley +1 more source
Sodium ion capacitor (SIC) is currently constrained by the low discharge capacity of commercial activated carbon as positive electrode material. This review provides a holistic summary of research efforts on alternative porous carbon materials for SIC. Image created by the authors with www.biorender.com.
Ademola Adeniji +2 more
wiley +1 more source
Metal assisted photochemical etching of 4H silicon carbide
Abstract Metal assisted photochemical etching (MAPCE) of 4H–silicon carbide (SiC) in Na2S2O8/HF and H2O2/HF aqueous solutions is investigated with platinum as metallic cathode. The formation process of the resulting porous layer is studied with respect to
Markus Leitgeb +5 more
openaire +1 more source

