Results 41 to 50 of about 89 (89)
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Defect structure of 4H silicon carbide ingots
Journal of Crystal Growth, 2011Defects caused by 15R polytype inclusions in 4H silicon carbide ingots have been considered. Growth rate along with curvature of the interface determines the stability of the 4H-polytype reproduction. The domain structure arising in the 4H polytype as a result of foreign polytype inclusion has been analyzed.
A.O. Lebedev +5 more
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Dislocation nucleation in 4H silicon carbide epitaxy
Journal of Crystal Growth, 2004Abstract The dislocation nucleation during 4H silicon carbide homoepitaxy has been investigated using chemical etching, optical microscopy, atomic force microscopy, and transmission electron microscopy. Threading edge dislocations formed characteristic arrays of etch pit pairs on the epilayer surface, perpendicular to the off-cut direction.
S. Ha +3 more
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Dislocation conversion in 4H silicon carbide epitaxy
Journal of Crystal Growth, 2002Abstract The propagation of basal plane dislocations from off-axis 4H silicon carbide substrates into the homo-epitaxial layers has been investigated using chemical etching, optical microscopy, and transmission electron microscopy (TEM). The etch pit densities of threading edge and basal plane dislocations changed significantly across the epilayer ...
S. Ha +3 more
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Low frequency noise in 4H silicon carbide
Journal of Applied Physics, 1997The bulk low frequency noise has been investigated in the 4H silicon carbide polytype. In the temperature range of 300–550 K the noise spectral density S is proportional to f−1.5, where f is the measurement frequency. A very low noise level has been observed for the bulk noise. At 300 K, the Hooge constant α is as small as (2–4)×10−6 at f=20 Hz and α⩽5×
M. E. Levinshtein +3 more
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Defects In 4H Silicon Carbide CVD Epilayers
MRS Proceedings, 1996AbstractThe characteristic defects of 4H-SiC homoepitaxial thin films grown on bulk substrates using chemical vapor deposition (CVD) are described based on transmission electron microscopy (TEM), atomic force microscopy (AFM) and surface decoration studies. Emphasis is placed on understanding the formation mechanism of surface triangular defects. Cross-
L. Zhou, P. Pirouz, J. A. Powell
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Annealing of Al implanted 4H silicon carbide
Physica Scripta, 2006Al ions were implanted with multiple energies up to 250 keV at elevated temperatures in n-type 4H SiC epitaxial layers to reach a surface concentration of 1 x 10(20) cm(-3).
A Hallén +4 more
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Selective Generation of V2 Silicon Vacancy Centers in 4H-Silicon Carbide
Nano LettersThe deterministic generation of individual color centers with defined orientations or types in solid-state systems is paramount for advancements in quantum technologies. Silicon vacancies in 4H-silicon carbide (4H-SiC) can be formed in V1 and V2 types.
Yongzhou Xue +7 more
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Charge Sheet Super Junction in 4H-Silicon Carbide
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2020SuperJunctions (SJs) have long been realized in Si. However, their fabrication in 4H-Silicon Carbide (SiC) has been problematic because of poor control of the p-dopant activation efficiency in SiC. We propose that this problem related to SiC material be overcome using a version of SJ called Charge Sheet SJ (CSSJ) which we proposed in the context of Si ...
K. Akshay +2 more
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Radiation-induced defect centers in 4H silicon carbide
Diamond and Related Materials, 1997Abstract Deep level transient spectroscopy (DLTS) and low temperature photoluminescence (LTPL) were applied to investigate radiation-induced defect centers and their thermal stability in 4H silicon carbide (SiC) epilayers grown by chemical vapor deposition (CVD).
Thomas Dalibor +6 more
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Four-point probe characterization of 4H silicon carbide
Solid-State Electronics, 2011Abstract We report on four-point probe measurements on SiC wafers as such measurements give erratic data. Current–voltage measurements on n-type SiC wafers doped to 3 × 10 18 cm −3 are non-linear and single probe I – V measurements are symmetrical for positive and negative voltages.
N. Chandra +3 more
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