Results 141 to 150 of about 582,324 (168)

Solder Bead on High Density Interconnect Printed Circuit Board

2008 IEEE International Test Conference, 2008
Solder bead probing is a test technology primarily targeting high-speed/high-density printed circuit boards (PCBs). High Density Interconnect (HDI) PCBs are gaining in popularity to support high speed and smaller form factor requirements. This paper summarizes the requirements for placing solder beads on HDI PCBs.
openaire   +1 more source

Particle board density and surface quality

Proceeding Book of 2nd International Conference on Contemporary Academic Research ICCAR 2023, 2023
openaire   +1 more source

High density boarding and alighting

2012
Ian Rowe, Nick Tyler
openaire   +1 more source

Synergistic flame retardant effect of a new N-P flame retardant on poplar wood density board

Polymer Degradation and Stability, 2023
exaly  

Design and Analysis of High Power Density On-Board Charger with Active Power Decoupling Circuit for Electric Vehicles

Energies, 2023
Won-Jin Son, Byoung Kuk Lee
exaly  

Development of medium density particle board from Lantana camara

AIP Conference Proceedings, 2023
V. R. Ramkumar, K. Thanigai, M. C. Kiran, V. Prakash, Manoj Kumar Dubey   +4 more
openaire   +1 more source

Calculating board incorporating a linear density transform

Spectrochimica Acta, 1965
openaire   +1 more source

Analytical pyrolysis properties of waste medium-density fiberboard and particle board

Journal of Industrial and Engineering Chemistry, 2015
Young-Kwon Park
exaly  

A High-Efficiency High-Density Wide-Bandgap Device-Based Bidirectional On-Board Charger

IEEE Journal of Emerging and Selected Topics in Power Electronics, 2018
Bin Li, Qiang Li, Fred C Lee
exaly  

The American Cancer Society challenge goal to reduce US cancer mortality by 50% between 1990 and 2015: Results and reflections

Ca-A Cancer Journal for Clinicians, 2016
Ahmedin Jemal, Otis W Brawley
exaly