Differential continuum damage mechanics models for creep and fatigue of unidirectional metal matrix composites [PDF]
Three multiaxial isothermal continuum damage mechanics models for creep, fatigue, and creep/fatigue interaction of a unidirectional metal matrix composite volume element are presented, only one of which will be discussed in depth.
Arnold, S. M., Kruch, S.
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Thermostructural Numerical Analysis of the Thrust Chamber of a Liquid Propellant Rocket Engine. [PDF]
Materials (Basel), 2022 Citarella R +3 more
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Finite element implementation of state variable-based viscoplasticity models [PDF]
The implementation of state variable-based viscoplasticity models is made in a general purpose finite element code for structural applications of metals deformed at elevated temperatures.
Chang, T. Y. P. +2 more
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A survey of unified constitutive theories [PDF]
The state of the art of time temperature dependent elastic viscoplastic constitutive theories which are based on the unified approach werre assessed.
Bodner, S. R. +3 more
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Parameter identification of chaboche material model using indantation test data and inverse approach
, 2015 In this paper genetic algorithm and sensitivity analysis are used to identify 6 parameters of Chaboche kinematic hardening model using repeated Finite element (FE) simulations of indentation test. Five of them are material constants of Chaboche kinematic hardening model itself.
Cermak, Martin +3 more
openaire +1 more source
A Comprehensive Nonlinear Multiaxial Life Prediction Model. [PDF]
Materials (Basel)Tian Z, Liu Y, Xia G, He X.
europepmc +1 more source
Mechanical Behavior of Austenitic Steel under Multi-Axial Cyclic Loading. [PDF]
Materials (Basel), 2023 Biswas A +5 more
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The Overload Effect on the Crack Tip Damage Mechanism in a 7075 Aluminum Alloy. [PDF]
Materials (Basel)Xie C, Zheng Z, Li L, Sun T.
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Special Issue "Fracture Mechanics and Fatigue Damage of Materials and Structures". [PDF]
Materials (Basel), 2023 Lesiuk G, Rozumek D.
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Multi-Algorithm Ensemble Learning Framework for Predicting the Solder Joint Reliability of Wafer-Level Packaging. [PDF]
Materials (Basel)Su Q, Chiang KN.
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