Results 191 to 200 of about 18,989 (261)
Large Faraday rotation at room temperature is observed in thin films of discotic copper (Cu2+: 3d9) and vanadyl (VO2+: 3d1) enaminoketone complexes. The large Verdet constant originates from a high density of paramagnetic centers, metal‐ligand p−d hybridization and π orbitals involved in optical transitions (identified by DFT calculations), as well as ...
Karolina Łempicka‐Mirek +8 more
wiley +1 more source
Thickness‐Dependent Infrared Emissivity of Ultrathin Freestanding MoSiN Nanocomposite Membranes
ABSTRACT Metals and dielectrics show opposite trends in thickness‐dependent infrared emissivity: metallic films exhibit a rise in emissivity below a critical thickness, while dielectric films show a corresponding decline. For applications demanding both high emissivity and mechanical strength in membranes with nanoscale thickness, combining these ...
Reethu Sebastian +3 more
wiley +1 more source
Multimodal perovskite nanocrystals enable optical thermometry across multiple excitation and emission regimes, spanning the UV–Vis–NIR spectral range. By combining upconversion, downshifting, and persistent luminescence, the platform bridges conventional Boltzmann and non‐Boltzmann thermometric approaches.
Adrian Drozdowski +2 more
wiley +1 more source
Chemical Mechanical Lapping of 316 Based on Solid-Phase Fenton Reaction. [PDF]
Guo L +6 more
europepmc +1 more source
Lapping of Soft-Brittle Lithium Niobate Crystal with Fixed Abrasive Pad. [PDF]
Zhu N, Gao X, Tang C, Chen J, Zhu Y.
europepmc +1 more source
Laser-Based Polishing of Additively Manufactured PA12 and PAEK Polymer Components Using a Robotic System. [PDF]
Uluz E, Metz L, Hedwig L, Bremen S.
europepmc +1 more source
Effectiveness of electropolishing step on elimination of upstream manufacturing material residues on metallic orthopaedic medical device. [PDF]
Godlewska K +5 more
europepmc +1 more source
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Electro-chemical mechanical polishing of copper and chemical mechanical polishing of glass
Journal of Materials Processing Technology, 2004Abstract In IC and optical manufacturing some of the materials that are polished after grinding are Si, Ge, Pyrex and BK 7 glass. In the case of Al, Cu and W, they are deposited and are CMP polished. The polishing process used on IC wafers is chemical mechanical polishing (CMP) that has in built facilities for planarizing as well. There are two major
Venkatesh, Vasisht C. +2 more
openaire +2 more sources
Mechanical Mechanisms of Chemical Mechanical Polishing
Advanced Materials Research, 2008This paper describes a mechanical mechanism of chemical mechanical polishing (CMP) and the model is applied to the polishing of silicon substrates by polyurethane pads and slurries containing fumed silica as is typically done in the manufacture of integrated circuits.
Steven Danyluk, Sum Huan Ng
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Surface Conformable Polishing Mechanism for Chemical Mechanical Polishing
Journal of The Electrochemical Society, 2009Surface conformable polishing mechanism, which means a uniform removal mechanism conforming to wafer thickness variation, was developed for chemical mechanical polishing. The polishing mechanism provides both global uniform removal regardless of wafer curvature and local planarization to protruding parts on a patterned surface.
Takashi Fujita, Junji Watanabe
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