Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review [PDF]
International Journal of Precision Engineering and Manufacturing-Green Technology, 2021 Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in semiconductor fabrication for highly integrated devices. Recently, environmental burden caused by the CMP process was assessed because of interest in the global environment.
Lee H, Kim H, Jeong H.
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Soft Chemical Mechanical Polishing Pad for Oxide CMP Applications [PDF]
ECS Journal of Solid State Science and Technology, 2021 Chemical mechanical polishing (CMP) is widely accepted as the best planarization technique for fabricating nanoscale devices. A soft CMP pad that can enable higher oxide removal rates (RRs) and good planarity has been proposed for oxide CMP applications. In this study, three pads namely, Pad-1 (hard), Pad-2 (soft), and a commercial pad (hard) were used
Nandan Baradanahalli Kenchappa +6 more
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Contrast Experiments in Dielectrophoresis Polishing (DEPP)/Chemical Mechanical Polishing (CMP) of Sapphire Substrate [PDF]
Applied Sciences, 2019 The broad applications of sapphire substrates in many fields warrants an urgent demand for a highly efficient and high precision polishing method for the sapphire substrates. The authors proposed a novel sapphire substrate polishing method that is based on the dielectrophoresis (DEP) effect.
Tianchen Zhao +5 more
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Recent Developments in Chemical Mechanical Polishing (CMP) for Precision Manufacturing
International Journal of Advanced Research in Science, Communication and Technology, 2022 Advanced developments and applications of Chemical Mechanical Planarization/Polishing (CMP) did by researchers in current decade were discussed in this article. Topics on which this article forms the basis are Abrasives and slurry developments, environment and safety conditions, manufacturing process improvements, modelling and simulations methods for ...
Amey S. Kulkarni, Ankur Gupta
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Scratch generation probability in chemical mechanical polishing (CMP) process
, 2006 Chemical mechanical polishing (CMP) process is a critical new technology to planarize the wafer surface aided by the combined force of the chemical etching and mechanical polishing. In this process, defectivity due to scratch generation has become more and more important as it influences the wafer product quality, throughput and cost significantly with
Yingying Han
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Electrochemical Characterizations on Chemical Mechanical Polishing Compositions of Polishing Ruthenium Films in CMP Processes [PDF]
ECS Meeting Abstracts, 2012 Abstract not Available.
Tom Shi, James Henry, James Schlueter
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Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes. [PDF]
Micromachines (Basel), 2023 Lee H.
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Prediction of Removal Rates in Chemical–Mechanical Polishing (CMP) Using Tribocorrosion Modeling [PDF]
Journal of Bio- and Tribo-Corrosion, 2016 The influence of electrochemical parameters, open circuit potential, and passivation kinetics, on the removal rates of tungsten in chemical–mechanical polishing (CMP) was investigated in the presented study. Removal rates were measured on a CMP machine, while electrochemical test were performed separately, both using technical CMP slurries ...
Jelena Stojadinović +2 more
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Managing Corrosion during the Chemical Mechanical Polishing (CMP) of Metal Films [PDF]
ECS Meeting Abstracts, 2012 Abstract not Available.
James Schlueter, James Henry, Tom Shi
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Surface Interaction of Barrier Slurry Formulation Additives during Chemical Mechanical Polishing (CMP) [PDF]
ECS Meeting Abstracts, 2010 Abstract not Available.
James Schlueter +3 more
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