Results 101 to 110 of about 1,057 (152)

A Comparative Analysis of Laser-Ablated Surface Characteristics Between the Si Face and C Face of Silicon Carbide Substrates. [PDF]

Micromachines (Basel)
Tsai HY, Lin YH, Huang KC, Yeh JA, Yang Y, Ding CF.   +5 more
europepmc   +1 more source

A Study on Pad Surface Characterization and Design for Chemical Mechanical Polishing (CMP)- Fabrication Process and Prototype -

, 2003
Sung‐Hoon Lee, David Dornfeld
openalex   +1 more source

Interaction mechanism of Al₂O₃ abrasive in tantalum chemical mechanical polishing. [PDF]

RSC Adv
Lei R, Jiang L, Zhang H, Chen Y, Zheng J, Sun J, Zhao Q, Qian L.   +7 more
europepmc   +1 more source

Mechanisms of Chemically Promoted Material Removal Examined for Molybdenum and Copper CMP in Weakly Alkaline Citrate-Based Slurries. [PDF]

Materials (Basel)
Gamagedara KU, Roy D.
europepmc   +1 more source

Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing. [PDF]

Sci Rep
Ye L, Wu J, Zhu X, Liu Y, Li W, Chuai S, Wang Z.   +6 more
europepmc   +1 more source

Green Chemical Shear-Thickening Polishing of Monocrystalline Silicon. [PDF]

Nanomaterials (Basel)
Xie J, Shi F, Wang S, Peng X, Hao Q.
europepmc   +1 more source

Experimental Study on the Role of Bond Elasticity and Wafer Toughness in Back Grinding of Single-Crystal Wafers. [PDF]

Materials (Basel)
Yun JC, Lim DS.
europepmc   +1 more source

Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding. [PDF]

Micromachines (Basel)
Zheng T, Xu Y, Mei C, Chen Y, Chang L, Yang G, Hu Q, Shi T, Yuan Y, Yu Z, Li L.   +10 more
europepmc   +1 more source

The Effect of Sodium Hexametaphosphate on the Dispersion and Polishing Performance of Lanthanum-Cerium-Based Slurry. [PDF]

Materials (Basel)
Mei Y, Chen W, Chen X.
europepmc   +1 more source