Results 21 to 30 of about 1,057 (152)

Monolithic Integration of ScAlN Modulators on Silicon‐On‐Insulator Platform

Laser &Photonics Reviews, EarlyView.
Monolithic integration of scandium‐doped aluminum nitride (ScAlN) modulators on a silicon‐on‐insulator platform is reported. A multilayer electrode design enhances RF‐optical field overlap, enabling direct access to the diagonal electro‐optic coefficient and improved modulation efficiency.
Sihao Wang, Bo Li, Lin Zhou, Victor Leong, Nanxi Li, Xianshu Luo, Di Zhu   +6 more
wiley   +1 more source

Flax Fiber Flyash/Steel Reinforced Sustainable Composites in Corrosive Conditions: Mechanical, Wear, and Corrosion Properties

Polymer Composites, EarlyView.
Materials used for fabricating sustainable composites. ABSTRACT A composite sample with 18% flax fiber flyash (FF) exhibits increased tensile strength (TS) and greater load‐transfer efficiency of the reinforcement under corrosive conditions.
Sumesh Keerthiveettil Ramakrishnan, Kavimani Vijayananth, Tatana Vackova   +2 more
wiley   +1 more source

Understanding UV‐Induced Degradation Mechanisms in SHJ Solar Cells and Their Reversibility: The Role of Hydrogen and Doping

Progress in Photovoltaics: Research and Applications, EarlyView.
This study investigates the UV‐induced degradation of silicon heterojunction cell precursors by isolating the impact of subcell layers under controlled UVA and UVB irradiation. Front hydrogenated amorphous silicon (i/n)a‐Si:H selective layers are identified as key degradation sites, leading to significant losses in minority carrier lifetime and iVoc ...
Hugo Lajoie, Frédéric Jay, Maxime Babics, Tristan Gageot, Romain Couderc, Névine Rochat, Hélène Coudert‐Alteirac, Sandrine Therias   +7 more
wiley   +1 more source

Metal‐Free Submicron‐Hollow‐Fiber Conjugated Polymer Sponges for Efficient Pollutant Removal and Thermal Insulation

Small, EarlyView.
Mimicking natural tubular structures, metal‐free conjugated hollow fibers are synthesized via one‐pot Chichibabin condensation. Pyridinic networks spontaneously self‐assemble into submicron hollow fibers and entangle into spongy monoliths—without templates, metals, or post‐processing.
Songah Jeong, Hyungwoo Kim
wiley   +1 more source

A magnetically controlled chemical–mechanical polishing (MC-CMP) approach for fabricating channel-cut silicon crystal optics for the High Energy Photon Source [PDF]

, 2022
Zhen Hong, Qianshun Diao, Wei Xu, Qingxi Yuan, Junliang Yang, Zhongliang Li, Yongcheng Jiang, Changrui Zhang, Dongni Zhang, Fang Liu, Xiaowei Zhang, Peng Liu, Ye Tao, Weifan Sheng, Ming Li, Yidong Zhao   +15 more
openalex   +1 more source

Virtualization as a New Scaling Law for Semiconductor Devices Beyond Geometric Scaling

Small, EarlyView.
AI‐enabled semiconductor scaling law. Virtualization emerges as an AI‐enabled scaling law for semiconductors, where progress depends on replacing physical iteration with credible virtual evidence. Surrogate modeling accelerates design‐space exploration, digital twins virtualize process learning, and defect‐to‐reliability inference advances ...
Zeheng Wang, Xinghuan Chen, Fanfan Lin, Xinze Li, Fangzhou Wang, Songnan Guo, Simin Yu, Liang Li, Jing‐Kai Huang   +8 more
wiley   +1 more source

Development of modeling to investigate polyurethane pad hardness in chemical mechanical planarization/polishing (CMP) process [PDF]

, 2022
Le Nam Quoc Huy, Chun-Yu Lin, Chao‐Chang A. Chen   +2 more
openalex   +1 more source

Monolithic 3D Nanoelectrode Arrays on CMOS Circuitry for Scalable, High‐Resolution Neural Recording

Small, EarlyView.
A CMOS‐integrated in vitro electrophysiology platform with 26,400 3D nanoelectrodes enables high‐resolution extracellular recordings with enhanced spatial sensitivity. Wafer‐scale, low‐temperature post‐fabrication monolithic integration of nanoelectrodes on foundry‐made CMOS chips preserves circuit functionality and electrical performance.
Aziliz Lecomte, Laurent Mazenq, Marie‐Charline Blatché, Aurélie Lecestre, Guilhem Larrieu   +4 more
wiley   +1 more source

Wafer Scale III‐Nitride Deep‐Ultraviolet Vertical‐Cavity Surface‐Emitting Lasers Featuring Nanometer‐Class Control of Cavity Length

Advanced Science, Volume 13, Issue 13, 3 March 2026.
A DUV‐VCSEL strategy featuring the nanometer‐class control of the cavity length is proposed in the DUV optoelectronic framework based on GaN templates. After the sapphire removal, a self‐terminated etching technology is developed, whereby the cavity length can be accurately determined by epitaxy instead of the fabrication process. As such, a record low
Chen Ji, Jiaming Wang, Fujun Xu, Lisheng Zhang, Jing Lang, Ziyao Zhang, Fuyun Tan, Chengzhi Ji, Junchuan Zhang, Erfei Zhang, Xiangning Kang, Zhixin Qin, Guangxu Ju, Jiejun Wu, Xuelin Yang, Ning Tang, Xinqiang Wang, Weikun Ge, Bo Shen   +18 more
wiley   +1 more source

Three‐Dimensional Heterogeneous Bonding for High‐Density and Low‐Noise TMR Sensing Arrays

Advanced Science, Volume 13, Issue 13, 3 March 2026.
This study demonstrates a three‐dimensional heterogeneous bonding approach to fabricate compact TMR sensing units with double junction numbers and improved magnetic performance. Optimized Au─Au bonding and angled etching improve device integrity, noise characteristics, and magnetoresistance.
Zi'ang Han, Zhenhu Jin, Chenglong Zhang, Jiamin Chen   +3 more
wiley   +1 more source