Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response [PDF]
Wei-Lan Chiu, Ching‐I Huang
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Effect of Abrasive Particles on Frictional Force and Abrasion in Chemical Mechanical Polishing(CMP) [PDF]
Goo-Youn Kim
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Front Cover: Strategies for Enhancing SiO 2 Chemical‐Mechanical Polishing (CMP): Functional Nanoparticle Abrasive Design and Integration [PDF]
Hyeonseok Lee +7 more
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Molecular dynamics simulations addressing atomic-scale core issues in chemical mechanical polishing and post-CMP cleaning: A concise review [PDF]
Lifei Zhang, Ming Ji, Xinchun Lu
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Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives [PDF]
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Improvement of Chemical Mechanical Polishing (CMP) Performance of Nickel by Additions of Abrasive and Various Oxidizers [PDF]
Gwon-Woo Choi
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Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts [PDF]
Toshiro Doi +27 more
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Research on the Application of Diamond Film in Chemical Mechanical Polishing. [PDF]
Wang Y +10 more
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Simulation Analysis of the Chemical Mechanical Polishing Process for Monocrystal 4H-Silicon Carbide Based on Molecular Dynamics. [PDF]
Lei Y, Guo W, Feng K, Sun Z.
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