Results 81 to 90 of about 1,057 (152)

Multi-Field Characterisation of Material Removal Processes in Ultrasonic Magnetorheological Chemical Compound Polishing of GaN Wafers. [PDF]

Micromachines (Basel)
Liang H, Chen W, Fu Y, Zhou W, Mo L, Wen Q, Liu D, He J.   +7 more
europepmc   +1 more source

Kinetic study of copper chemistry in chemical mechanical polishing (CMP) by an in-situ real time measurement technique

, 2008
Changhoon Choi
openalex   +2 more sources

Numerical Simulation and Experimental Study on Picosecond Laser Polishing of 4H-SiC Wafer. [PDF]

Micromachines (Basel)
Yan Y, Cheng Y, Chen S, Tang Y, Zhang F, Gao P.   +5 more
europepmc   +1 more source

Research on influences of contact force in chemical mechanical polishing (CMP) process

, 2014
Lei Han, Hongwei Zhao, Qixun Zhang, Mingjun Jin, Lin Zhang, Peng Zhang   +5 more
openalex   +1 more source

A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing. [PDF]

Microsyst Nanoeng
Hao Y, Ding Y, Zhang Z, Yang B, Zhang J, Xie H, Chen Z.   +6 more
europepmc   +1 more source

Investigation the CMP process of 6 H-SiC in H₂O₂ solution with ReaxFF molecular dynamics simulation. [PDF]

Sci Rep
Gu Y, Feng K, Xu L, Zhao L, Zhao T, Lyu B.   +5 more
europepmc   +1 more source

Study on Self-Sharpening Mechanism and Polishing Performance of Triethylamine Alcohol on Gel Polishing Discs. [PDF]

Micromachines (Basel)
Lei Y, Xu L, Feng K.
europepmc   +1 more source

Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers. [PDF]

Materials (Basel)
Chen H, Lee S, Kang M, Youn HS, Go S, Kang E, Cho CR.   +6 more
europepmc   +1 more source

Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy. [PDF]

ACS Appl Nano Mater
Alderete NA, Daharwal PD, Ciobanu CV, Stan G.   +3 more
europepmc   +1 more source