Results 101 to 110 of about 567,761 (300)

Recent Advances in Transparent Microelectrode Device Architecture and Fabrication Strategies for Biomedical Applications

Advanced Materials Technologies, EarlyView.
Transparent microelectrode arrays enable simultaneous optical and electrical electrophysiology with high spatiotemporal resolution, allowing multimodal observations of dynamic biological systems. Advances in materials and device architectures improve device performance by addressing key trade‐offs between optical transparency, impedance, and ...
Michael Abraham Listyawan, Tran Bach Dang, Chi Cong Nguyen, Yee Lap Pong, Tianruo Guo, Thanh Nho Do, Hoang‐Phuong Phan   +6 more
wiley   +1 more source

A CMOS Humidity Sensor for Passive RFID Sensing Applications

Sensors, 2014
This paper presents a low-cost low-power CMOS humidity sensor for passive RFID sensing applications. The humidity sensing element is implemented in standard CMOS technology without any further post-processing, which results in low fabrication costs.
Fangming Deng, Yigang He, Chaolong Zhang, Wei Feng   +3 more
doaj   +1 more source

High performances monolithic CMOS detectors for space applications [PDF]

, 2001
During the last 10 years, research about CMOS image sensors (also called APS -Active Pixel Sensors) has been intensively carried out, in order to offer an alternative to CCDs as image sensors.
Franck Corbiere, Jean A. Farre, Tulet, Michel, Davancens, Robert, Farre, Jean, Bruno Vignon, Olivier Saint-Pe, Robert Davancens, Franck Larnaudie, Pierre Magnan, Larnaudie, Franck, Corbière, Franck, Philippe Martin-Gonthier, Saint-Pé, Olivier, Michel Tulet, Vignon, Bruno, Magnan, Pierre, Martin-Gonthier, Philippe   +17 more
core   +1 more source

Wafer‐Scale Top‐Down Patterning of Metal Halide Perovskites

Advanced Materials Technologies, EarlyView.
Wafer‐scale patterning of metal halide perovskite films is demonstrated on 150 mm substrates using a chemically amplified resist, polymethyl methacrylate (CAR‐PMMA) and a single reactive ion etching step. The streamlined process preserves film luminescence while defining submicrometer features across the full wafer, enabling dense, scalable integration
Federico Fabrizi, Ardeshir Esteki, Holger Lerch, Saeed Goudarzi, Liudmila Starodubtceva, Gerhard Müller‐Newen, Maryam Mohammadi, Max C. Lemme   +7 more
wiley   +1 more source

Repair Techniques for Hybrid Nano/CMOS Computational Architecture

, 2009
—Presence of high defect rate in nanofabrics due to the inadequate fabrication processes has held back the development of emerging technology architecture. In this work, we propose two repair techniques to provide high level of defect tolerance in lookup
Srivastava, Saket, Melouki, Aissa, Al-Hashimi, Bashir   +2 more
core   +1 more source

A 12-Bit High-Speed Column-Parallel Two-Step Single-Slope Analog-to-Digital Converter (ADC) for CMOS Image Sensors

Sensors, 2014
A 12-bit high-speed column-parallel two-step single-slope (SS) analog-to-digital converter (ADC) for CMOS image sensors is proposed. The proposed ADC employs a single ramp voltage and multiple reference voltages, and the conversion is divided into coarse
Tao Lyu, Suying Yao, Kaiming Nie, Jiangtao Xu   +3 more
doaj   +1 more source

Vertical Gate‐All‐Around SiGeSn/GeSn/SiGeSn Nanowire Transistors for Energy‐Efficient Electronics

Advanced Materials Technologies, EarlyView.
Band‐engineered SiGeSn/GeSn/SiGeSn heterostructures enable complementary vertical nanowire MOSFETs and steep slope tunnel FETs (TFETs) within a unified Group‐IV platform. Leakage suppression and tunnelling‐path engineering demonstrate an effective strategy for future low‐power and energy‐efficient integrated electronics.
Kenta Moto, Yannik Junk, Marvin Frauenrath, Florian Bärwolf, Jean‐Michel Hartmann, Andreas Mai, Detlev Grützmacher, Joachim Knoch, Dan Buca, Qing‐Tai Zhao   +9 more
wiley   +1 more source

Wafer‐Scale CMOS‐Compatible Electro‐Thermally Actuated Nanomechanical Non‐Volatile Switch with Out‐of‐Plane Electrode Configuration

Advanced Electronic Materials
The rapid growth of data‐intensive applications has significantly heightened the concerns about power consumption in current computing systems. From this perspective, there have been substantial efforts to implement ultra‐low power systems by integrating
Yong‐Bok Lee, Pan‐Kyu Choi, Min‐Ho Kang, Su‐Hyun Kim, Seung‐Jun Lee, Tae‐Soo Kim, So‐Young Lee, Jun‐Bo Yoon   +7 more
doaj   +1 more source

Red‐Light Tomographic Volumetric 3D Printing in Seconds for Fabrication of Colorless Structures

Advanced Materials Technologies, EarlyView.
A custom red‐light‐responsive TVAM platform combines methylene blue, triethanolamine, and PEGDA to fabricate transparent crosslinked hydrogels. Light patterns are projected into a rotating resin container, where a sacrificial photoinitiator system enables rapid polymerization and colorless channel‐containing structures, utilizing low‐energy light for ...
Ali Eftekhari, Qianyi Zhang, Shahla Radmehr, Felix Wechsler, Riccardo Rizzo, Ville Santala, Minna Kellomäki, Alexander Efimov, Timo Laaksonen, Christophe Moser   +9 more
wiley   +1 more source

Scalable on-chip multiplexing of silicon single and double quantum dots

Communications Physics
Owing to the maturity of complementary metal oxide semiconductor (CMOS) microelectronics, qubits realized with spins in silicon quantum dots (QDs) are considered among the most promising technologies for building scalable quantum computers. For this goal,
Heorhii Bohuslavskyi, Alberto Ronzani, Joel Hätinen, Arto Rantala, Andrey Shchepetov, Panu Koppinen, Janne S. Lehtinen, Mika Prunnila   +7 more
doaj   +1 more source