Results 181 to 190 of about 6,180 (208)
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CMOS and MEMS process investigation
Proceedings of the Thirteenth Biennial University/Government/Industry Microelectronics Symposium (Cat. No.99CH36301), 2003As MEMS technology matures as an industry, the integration of standard integrated circuit and MEMS devices will continue to increase. Presented is a brief overview of the work that others have done to solve these problems using hybrid, monolithic, or bonding techniques.
T. Whipple, G. Cibuzar
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Processes for the Integration of MEMS and CMOS
2010 12th Electronics Packaging Technology Conference, 2010Wafer to wafer bonding was an enabling technology for MEMS because it provided the needed protection for the devices by capping them at the wafer level allowing them to survive in the required operating environments such as the automotive environment.
E.F. Pabo +4 more
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Wafer-Level Packaging Symposium, 2005
ABSTRACT Under Bump Metallization (UBM) using Electroless Nickel / Immersion Gold (ENIG) is a low cost option for deposition of UBM layers. Unlike dry methods involving vacuum techniques, this technology uses wet processes and can offer economic and throughput advantages.
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ABSTRACT Under Bump Metallization (UBM) using Electroless Nickel / Immersion Gold (ENIG) is a low cost option for deposition of UBM layers. Unlike dry methods involving vacuum techniques, this technology uses wet processes and can offer economic and throughput advantages.
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CMOS-MEMS novel resonator for filter tuning
2015 IEEE 58th International Midwest Symposium on Circuits and Systems (MWSCAS), 2015Novel MEMS resonators are presented in this work, and were designed in CMOS process. The devices were fabricated and tested. The work shows the combined CMOS and MEMS process. The resonators are designed in Fixed -Fixed beam structure. Applications are low power temperature tuning filters, and temperature sensors.
Hasan Goktas, M. E. Zaghloul
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Efficiency modeling of a CMOS MEMS convective accelerometer
7th International Conference on Design & Technology of Integrated Systems in Nanoscale Era, 2012This paper reports efficiency modeling using 3D FEM simulation of a convective accelerometer obtained by FSBM of a die fabricated using standard CMOS technology. In such sensors, best sensitivity is obtained by placing temperature detectors where air temperature is the most sensitive to acceleration. This will obviously depends on 3D effects.
Brahim Mezghani +5 more
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Integrated MEMS in Conventional CMOS
1998This paper provides an overview of fabrication and design of CMOS-based microelectromechanical systems with emphasis on inertial sensor and data storage applications. High-aspect-ratio (4.4:1) microstructures can be fabricated using conventional CMOS processing followed by a sequence of maskless dry-etching steps.
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Proceedings of 1997 IEEE International Symposium on Circuits and Systems. Circuits and Systems in the Information Age ISCAS '97, 2002
H. Baltes, A. Haberli
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H. Baltes, A. Haberli
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CMOS MEMS Resonator for Physical Reservoir Computing
2023 IEEE SENSORS, 2023Yi Chiu +5 more
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