Results 1 to 10 of about 77 (71)
STUDY OF PROPERTIES OF DIFFUSION-HARDENING COMPOSITE SOLDER GaSn — CuSn — Mo [PDF]
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2020 The article discusses the possibility of regulating the properties of a diffusion-hardening solder based on a low-melting gallium-tin alloy and a solid component consisting of a copper-tin alloy powder by introducing an inert metal molybdenum powder and ...
V.М. Skachkov +2 more
doaj +3 more sources
Diffuzionno-hardening solders based alloy gallium-indium-tin and powder of metal PCTSP5 reinforced with titanium [PDF]
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2018 The paper considers a new composition of diffusion-hardening solder based on a low-melting gallium alloy and copper-tin spherical powder (PCTSP5). The influence of the powder filler – titanium composition on the structure and properties of solder for ...
V.М. Skachkov +3 more
doaj +6 more sources
Properties of diffusion-hardening composite solder modified with tungsten powders
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2022 The article considers the regulation of the properties of diffusion-hardening solder based on a low-melting gallium-tin-zinc alloy and copper-tin alloy powder by introducing inert tungsten metal powders.
V.M. Skachkov +3 more
doaj +2 more sources
Properties of diffusion-hardening composite solder modified with vanadium powder
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2023 The article considers the effect of vanadium metal powder on the properties of diffusion-hardening solder based on a low-melting gallium-tin alloy and a solid component consisting of a copper-tin alloy powder.
V.М. Skachkov
doaj +2 more sources
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2021 The article discusses the possibility of regulating the properties of diffusion-hardening solder based on low-melted gallium-tin, gallium-indium-tin, gallium-tin-zinc alloys and a solid component consisting of a copper-tin alloy powder by introducing a ...
V.М. Skachkov +3 more
doaj +3 more sources
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2023 This article presents the results of a study of the properties of three diffusion-hardening solders based on low-melting gallium alloys and copper-tin alloy powder after the introduction of inert metal powders of titanium, zirconium, and hafnium in an ...
V.М. Skachkov +3 more
doaj +1 more source
Features of dynamics change of properties of diffusion-hardening solder at various conditions
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2022 A study was conducted of the change in the hardness of diffusion-hardening solder based on a low-melting gallium alloy: gallium-tin-zinc when interacting with the Spherical copper-tin alloy powder (SCTAP5) under normal conditions (temperature 25°C) and ...
V.M. Skachkov
doaj +1 more source
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2021 The article discusses the change in the properties of diffusion-hardening solder in dependence on the composition of the liquid metal component based on low-melting gallium alloys: gallium-tin, gallium-indium-tin and gallium-tin-zinc when interacting ...
V.М. Skachkov
doaj +1 more source
Composite solders on the basis of metal powders and gallium alloy [PDF]
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2017 The article considers new structures of composite alloys based on gallium. The effect of composition of powder filler on the structure and properties of the solder to impart unique properties and expansion of applications.
V.M. Skachkov +3 more
doaj +1 more source
Физико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2019 A number of diffusion-hardening composite solders for flux-free connection of heterogeneous materials are considered. The possibilities of changing the thermal expansion coefficient of connecting soldering joints are checked.
V.М. Skachkov +2 more
doaj +1 more source